参数资料
型号: TXS02326MRGER
厂商: Texas Instruments
文件页数: 18/35页
文件大小: 0K
描述: IC SIM CARD MUX 2:1 24VQFN
产品培训模块: Voltage Level Translation
标准包装: 1
应用: 移动电话
接口: I²C
电源电压: 1.7 V ~ 3.3 V
封装/外壳: 24-VFQFN 裸露焊盘
供应商设备封装: 24-VQFN 裸露焊盘(4x4)
包装: 标准包装
安装类型: 表面贴装
其它名称: 296-28065-6
100
1000
10000
100000
1000000
f - Frequency - Hz
2.95 V Vsim
1.8 V Vsim
0
-10
-20
-30
-40
-50
-60
-70
-80
-90
PSRR
-
Power
Supply
Rejection
Ratio
-
dB
-40°C Vsim
25°C Vsim
85°C Vsim
0
10
20
30
40
50
60
70
80
90
100
110
V
-Dropout
V
oltage
-
mV
D
O
0
5
10
15
20
25
30
35
40
45
50
I
- Output Current - mA
OUT
SCES795C
– SEPTEMBER 2010 – REVISED FEBRUARY 2011
Transient Response
As with any regulator, increasing the size of the output capacitor reduces over/undershoot magnitude but
increases duration of the transient response.
Minimum Load
The TXS02326 is stable and well-behaved with no output load. Traditional PMOS LDO regulators suffer from
lower loop gain at very light output loads. The TXS02326 employs an innovative low-current mode circuit to
increase loop gain under very light or no-load conditions, resulting in improved output voltage regulation
performance down to zero output current.
THERMAL INFORMATION
Thermal Protection
Thermal protection disables the output when the junction temperature rises to approximately +160
°C, allowing
the device to cool. When the junction temperature cools to approximately +140
°C the output circuitry is again
enabled. Depending on power dissipation, thermal resistance, and ambient temperature, the thermal protection
circuit may cycle on and off. This cycling limits the dissipation of the regulator, protecting it from damage
because of overheating.
Any tendency to activate the thermal protection circuit indicates excessive power dissipation or an inadequate
heat sink. For reliable operation, junction temperature should be limited to +85
°C maximum. To estimate the
margin of safety in a complete design (including heat sink), increase the ambient temperature until the thermal
protection is triggered; use worst-case loads and signal conditions. For good reliability, thermal protection should
trigger at least +35
°C above the maximum expected ambient condition of your particular application. This
configuration produces a worst-case junction temperature of +85
°C at the highest expected ambient temperature
and worst-case load.
The internal protection circuitry of the TXS02326 has been designed to protect against overload conditions. It
was not intended to replace proper heat sinking. Continuously running the TXS02326 into thermal shutdown will
degrade device reliability.
TYPICAL CHARACTERISTICS
Figure 10. PSRR
Figure 11. Dropout Voltage vs Output Current
2010–2011, Texas Instruments Incorporated
25
Product Folder Link(s): TXS02326
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