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参数资料
| 型号： | UBA2024BT/N1,518 |
| 厂商： | NXP Semiconductors |
| 文件页数： | 7/17页 |
| 文件大小： | 0K |
| 描述： | IC DRIVER HALF BRIDGE 14SO |
| 标准包装： | 2,500 |
| 类型： | CFL/TL 驱动器 |
| 频率： | 40.05kHz ~ 42.68kHz |
| 电流 - 电源： | 5mA |
| 电源电压： | 11.4 V ~ 13.3 V |
| 工作温度： | -40°C ~ 150°C |
| 封装/外壳： | 14-SOIC（0.154"，3.90mm 宽） |
| 供应商设备封装： | 14-SO |
| 包装： | 带卷 (TR) |
NXP Semiconductors
UBA2024
Half-bridge power IC for CFL lamps
8. Limiting values
Table 3. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min
Max
Unit
V HV
voltage on pin HV
normal operation
UBA2024P
UBA2024AP
UBA2024T
UBA2024AT
UBA2024BP
UBA2024BT
-
-
-
-
-
-
373
373
373
373
187
187
V
V
V
V
V
V
mains transients during 0.5 s
UBA2024P
UBA2024AP
UBA2024T
UBA2024AT
UBA2024BP
UBA2024BT
-
-
-
-
-
-
550
550
550
550
300
300
V
V
V
V
V
V
V FS
voltage on pin FS
V HV
V HV + 14
V
V DD
I DD
V PGND
V RC
V SW
SR
T j
T amb
T stg
supply voltage
supply current
voltage on pin PGND
voltage on pin RC
voltage on pin SW
slew rate
junction temperature
ambient temperature
storage temperature
low voltage; DC supply
low voltage; peak value is internally
limited; T amb = 25 ° C
referenced to SGND
I RC < 1 mA
I SW < 1 mA
pin OUT; repetitive
0
0
? 1
0
0
? 4
? 40
? 40
? 55
14
5
+1
V DD
V DD
+4
+150
+150
+150
V
mA
V
V
V
V/ns
° C
° C
° C
[1]
The maximum junction temperature must not be exceeded.
9. Thermal characteristics
Table 4.
Thermal characteristics
Symbol
R th(j-a)
R th(j-c)
Parameter
thermal resistance from junction to ambient
thermal resistance from junction to case
Conditions
in free air
SO14 package
DIP8 package
in free air
SO14 package
DIP8 package
Typ
95
95
8
16
Unit
K/W
K/W
K/W
K/W
[1]
In accordance with IEC 60747-1
UBA2024
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 6.2 — 1 November 2010
? NXP B.V. 2010. All rights reserved.
7 of 17
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相关代理商/技术参数 |
参数描述 |
|---|---|
| UBA2024DB/BP/120VDIP,598 | 制造商:NXP Semiconductors 功能描述:OPTIMIZED FOR 25W BURNER. PF >0.58. 600MS PRE-HEAT. - Boxed Product (Development Kits) 制造商:NXP Semiconductors 功能描述:120V 25W demo brd |
| UBA2024DB/BT/120VSO,598 | 制造商:NXP Semiconductors 功能描述:OPTIMIZED FOR 25W BURNER. PF >0.58. 600MS PRE-HEAT - Boxed Product (Development Kits) 制造商:NXP Semiconductors 功能描述:UBA2024 SO14 120V 25W demo board |
| UBA2024P | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:Half-bridge power IC for CFL lamps |
| UBA2024P/DB/120VDIP,598 | 制造商:NXP Semiconductors 功能描述:- Boxed Product (Development Kits) 制造商:NXP Semiconductors 功能描述:UBA2024P 13W 120V round demo board |
| UBA2024P/DB/230VDIP,598 | 制造商:NXP Semiconductors 功能描述:- Boxed Product (Development Kits) 制造商:NXP Semiconductors 功能描述:UBA2024P 13W 230V round demo board |
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