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参数资料
| 型号： | UCLAMP3304A.TCT |
| 厂商： | Semtech |
| 文件页数： | 4/8页 |
| 文件大小： | 0K |
| 描述： | IC TVS ARRAY 4-LINE 3.3V SC89-6 |
| 标准包装： | 1 |
| 系列： | uClamp™ |
| 电压 - 反向隔离（标准值）： | 3.3V |
| 电压 - 击穿： | 3.5V |
| 功率（瓦特）： | 40W |
| 电极标记： | 4 通道阵列 - 单向 |
| 安装类型： | 表面贴装 |
| 封装/外壳： | SOT-563，SOT-666 |
| 供应商设备封装： | SC-89-6 |
| 包装： | 标准包装 |
| 产品目录页面： | 1357 (CN2011-ZH PDF) |
| 其它名称： | UCLAMP3304ADKR |
μClamp3304A
PROTECTION PRODUCTS
Applications Information
Device Connection for Protection of Four Data Lines
These devices are designed to protect up to four
Circuit Diagram
unidirectional data lines. The device is connected as
follows:
1
3
4
6
1. Unidirectional protection of four I/O lines is
achieved by connecting pins 1, 3, 4, and 6 to the
data lines. Pins 2 and 5 are connected to ground.
The ground connection should be made directly to
the ground plane for best results. The path length
is kept as short as possible to reduce the effects
of parasitic inductance in the board traces.
Circuit Board Layout Recommendations for Suppres-
sion of ESD.
Good circuit board layout is critical for the suppression
of ESD induced transients. The following guidelines are
recommended:
Place the TVS near the input terminals or connec-
tors to restrict transient coupling.
Minimize the path length between the TVS and the
protected line.
Minimize all conductive loops including power and
ground loops.
The ESD transient return path to ground should be
kept as short as possible.
Never run critical signals near board edges.
Use ground planes whenever possible.
Matte Tin Lead Finish
Matte tin has become the industry standard lead-free
replacement for SnPb lead finishes. A matte tin finish
is composed of 100% tin solder with large grains.
Since the solder volume on the leads is small com-
pared to the solder paste volume that is placed on the
land pattern of the PCB, the reflow profile will be
determined by the requirements of the solder paste.
Therefore, these devices are compatible with both
lead-free and SnPb assembly techniques. In addition,
unlike other lead-free compositions, matte tin does not
have any added alloys that can cause degradation of
the solder joint.
2, 5
Protection of Four Unidirectional Lines
? 2005 Semtech Corp.
4
www.semtech.com
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相关代理商/技术参数 |
参数描述 |
|---|---|
| UCLAMP3305P | 制造商:SEMTECH 制造商全称:Semtech Corporation 功能描述:Low Voltage TVS for ESD Protection |
| UCLAMP3305P.TCT | 制造商:Semtech Corporation 功能描述:Diode TVS Quint Uni-Dir 3.3V 40W 6-Pin SLP EP T/R 制造商:Semtech 功能描述:Diode TVS Quint Uni-Dir 3.3V 40W 6-Pin SLP EP T/R |
| UCLAMP3306P | 制造商:SEMTECH 制造商全称:Semtech Corporation 功能描述:Low Voltage TVS for ESD Protection |
| UCLAMP3306P.TCT | 制造商:Semtech Corporation 功能描述: 制造商:Semtech Corporation 功能描述:3.3V ESD PROTECTION ARRAY |
| uClamp3311P | 制造商:Semtech Corporation 功能描述:DIODE TVS 3.3V ESD/CDE SLP1006P2 制造商:Semtech Corporation 功能描述:DIODE, TVS, 3.3V, ESD/CDE SLP1006P2 制造商:Semtech Corporation 功能描述:DIODE, TVS, 3.3V, ESD/CDE SLP1006P2, TVS Polarity:Bidirectional, Reverse Stand-O 制造商:Semtech Corporation 功能描述:DIODE, TVS, 3.3V, ESD/CDE SLP1006P2, TVS Polarity:Bidirectional, Reverse Stand-Off Voltage Vrwm:3.3V, Clamping Voltage Vc Max:18V, Peak Pulse Current Ippm:5A, No. of Pins:2, MSL:- , RoHS Compliant: Yes |
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