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参数资料
| 型号： | UDA1334BTS/N2,112 |
| 厂商： | NXP SEMICONDUCTORS |
| 元件分类： | DAC |
| 英文描述： | Low power audio DAC; Package: SOT369-1 (SSOP16); Container: Tube |
| 中文描述： | SERIAL INPUT LOADING, 24-BIT DAC, PDSO16 |
| 封装： | 4.40 MM, PLASTIC, MO-152, SOT369-1, SSOP-16 |
| 文件页数： | 11/22页 |
| 文件大小： | 160K |
| 代理商： | UDA1334BTS/N2,112 |
2000 Jul 31
19
NXP Semiconductors
Product specification
Low power audio DAC
UDA1334BTS
17.5
Suitability of surface mount IC packages for wave and reflow soldering methods
Notes
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”.
2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
3. If wave soldering is considered, then the package must be placed at a 45
° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
PACKAGE
SOLDERING METHOD
WAVE
BGA, LFBGA, SQFP, TFBGA
not suitable
suitable
HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, SMS
not suitable(2)
suitable
PLCC(3), SO, SOJ
suitable
LQFP, QFP, TQFP
not recommended(3)(4)
suitable
SSOP, TSSOP, VSO
not recommended(5)
suitable
相关PDF资料 |
PDF描述 |
|---|---|
| UDA1334BTS/N2,118 | Low power audio DAC; Package: SOT369-1 (SSOP16); Container: Reel Pack, SMD, 13" |
| UDA1338H/N1,518 | Multichannel audio coder-decoder; Package: SOT307-2 (QFP44); Container: Reel Dry Pack, SMD, 13" |
| UDA1338H/N1,557 | Multichannel audio coder-decoder; Package: SOT307-2 (QFP44); Container: Tray Dry Pack, Bakeable, Multiple |
| UDA1342TSDB-T | Audio CODEC |
| UDA1342TS/N1,512 | Audio CODEC; Package: SOT341-1 (SSOP28); Container: Tube Dry Pack |
相关代理商/技术参数 |
参数描述 |
|---|---|
| UDA1334TS | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:Low power audio DAC |
| UDA1334TS/N1,112 | 功能描述:数模转换器- DAC ULTRA LOW COST DAC RoHS:否 制造商:Texas Instruments 转换器数量:1 DAC 输出端数量:1 转换速率:2 MSPs 分辨率:16 bit 接口类型:QSPI, SPI, Serial (3-Wire, Microwire) 稳定时间:1 us 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:SOIC-14 封装:Tube |
| UDA1334TS/N1,118 | 功能描述:数模转换器- DAC ULTRA LOW COST DAC RoHS:否 制造商:Texas Instruments 转换器数量:1 DAC 输出端数量:1 转换速率:2 MSPs 分辨率:16 bit 接口类型:QSPI, SPI, Serial (3-Wire, Microwire) 稳定时间:1 us 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:SOIC-14 封装:Tube |
| UDA1334TS/N1118 | 制造商:NXP 功能描述: 制造商:NXP Semiconductors 功能描述: |
| UDA1334TSDH | 功能描述:数模转换器- DAC ULTRA LOW COST DAC RoHS:否 制造商:Texas Instruments 转换器数量:1 DAC 输出端数量:1 转换速率:2 MSPs 分辨率:16 bit 接口类型:QSPI, SPI, Serial (3-Wire, Microwire) 稳定时间:1 us 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:SOIC-14 封装:Tube |
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