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参数资料
| 型号： | UPC2709TB-E3-A |
| 厂商： | CEL |
| 文件页数： | 13/13页 |
| 文件大小： | 0K |
| 描述： | MMIC AMP 2.5GHZ SOT-26 |
| 标准包装： | 3,000 |
| 频率： | 2.0GHz ~ 2.5GHz |
| P1dB： | 8.7dBm（7.4mW） |
| 增益： | 30dB ~ 36.5dB |
| 噪音数据： | 3.5dB ~ 5dB |
| RF 型： | 手机，DBS，PCS |
| 电源电压： | 4.5 V ~ 5.5 V |
| 电流 - 电源： | 16mA ~ 29mA |
| 测试频率： | 500MHz |
| 封装/外壳： | SOT-26 |
| 包装： | 带卷 (TR) |
PC2709TB
NOTES ON CORRECT USE
(1) Observe precautions for handling because of electro-static sensitive devices.
(2) Form a ground pattern as widely as possible to minimize ground impedance (to prevent undesired oscillation).
All the ground pins must be connected together with wide ground pattern to decrease impedance difference.
(3) The bypass capacitor should be attached to the V CC pin.
(4) The inductor (L) must be attached between V CC and output pins. The inductance value should be determined in
accordance with desired frequency.
(5) The DC cut capacitor must be attached to input and output pin.
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered under the following recommended conditions. For soldering methods and condi-
tions other than those recommended below, contact your NEC sales representative.
Count: 3, Exposure limit: None
Count: 3, Exposure limit: None
Count: 1, Exposure limit: None
S o l d e r i n g M e t h o d
Infrared Reflow
VPS
Wave Soldering
Partial Heating
S o l d e r i n g C o n d i t i o n s
Package peak temperature: 235°C or below
Time: 30 seconds or less (at 210°C)
Note
Package peak temperature: 215°C or below
Time: 40 seconds or less (at 200°C)
Note
Soldering bath temperature: 260°C or below
Time: 10 seconds or less
Note
Pin temperature: 300°C
R e c o m m e n d e d C o n d i t i o n S y m b o l
IR35-00-3
VP15-00-3
WS60-00-1
–
Exposure limit: None
Time: 3 seconds or less (per side of device)
Note
Note After opening the dry pack, keep it in a place below 25°C and 65% RH for the allowable storage period.
Caution Do not use different soldering methods together (except for partial heating).
For details of recommended soldering conditions for surface mounting, refer to information document
SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E).
Data Sheet P12653EJ3V0DS00
13
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相关代理商/技术参数 |
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|---|---|
| UPC2709TB-EVAL | 功能描述:放大器 IC 开发工具 For UPC2709TB-A RoHS:否 制造商:International Rectifier 产品:Demonstration Boards 类型:Power Amplifiers 工具用于评估:IR4302 工作电源电压:13 V to 23 V |
| UPC2709TE3 | 制造商:未知厂家 制造商全称:未知厂家 功能描述:Analog IC |
| UPC2709T-E3 | 制造商: 功能描述: 制造商:NEC Electronics Corporation 功能描述: 制造商:undefined 功能描述: |
| UPC2709T-E3-A | 功能描述:MMIC AMP 2.5GHZ SOT-26 RoHS:是 类别:RF/IF 和 RFID >> RF 放大器 系列:- 标准包装:3,000 系列:- 频率:100MHz ~ 6GHz P1dB:9.14dBm（8.2mW） 增益:15.7dB 噪音数据:1.3dB RF 型:CDMA，TDMA，PCS 电源电压:2.7 V ~ 5 V 电流 - 电源:60mA 测试频率:2GHz 封装/外壳:0505（1412 公制） 包装:带卷 (TR) |
| UPC2709TE3CUT | 制造商:CLB 功能描述: |
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