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参数资料
| 型号： | UPD720102GC-YEB-A |
| 厂商： | Renesas Electronics America |
| 文件页数： | 28/38页 |
| 文件大小： | 0K |
| 描述： | IC HOST CTLR USB2.0 3-PORTS QFP |
| 标准包装： | 100 |
| 控制器类型： | USB 2.0 控制器 |
| 接口： | PCI |
| 电源电压： | 3.135 V ~ 3.465 V |
| 工作温度： | -20°C ~ 70°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 120-TQFP |
| 供应商设备封装： | 120-TQFP（14x14） |
| 包装： | 托盘 |
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Data Sheet S17998EJ4V0DS
32
μPD720102
5.
RECOMMENDED SOLDERING CONDITIONS
The
μPD720102 should be soldered and mounted under the following recommended conditions.
For soldering methods and conditions other than those recommended below, contact an NEC Electronics sales
representative.
For technical information, see the following website.
Semiconductor Device Mount Manual (http://www.necel.com/pkg/en/mount/index.html)
μPD720102GC-YEB-A: 120-pin plastic TQFP (Fine pitch) (14 × 14)
Soldering Method
Soldering Conditions
Symbol
Infrared reflow
Peak package’s surface temperature: 260 °C, Reflow time: 60 seconds or less
(220 °C or higher), Maximum allowable number of reflow processes: 3,
Exposure limit
Note
: 7 days (10 to 72 hours pre-backing is required at 125C°
afterwards),
Flux: Rosin flux with low chlorine (0.2 Wt% or below) recommended.
<Caution>
Non-heat-resistant trays, such as magazine and taping trays, cannot be baked
before unpacking.
IR60-107-3
Partial heating method
Pin temperature: 350°C or below,
Heat time: 3 seconds or less (per each side of the device) ,
Flux: Rosin flux with low chlorine (0.2 Wt% or below) recommended.
–
Note The Maximum number of days during which the product can be stored at a temperature of 5 to 25°C and a
relative humidity of 20 to 65% after dry-pack package is opened.
μPD720102F1-CA7-A: 121-pin plastic FBGA (8 × 8)
Soldering Method
Soldering Conditions
Symbol
Infrared reflow
Peak package’s surface temperature: 260 °C, Reflow time: 60 seconds or less
(220 °C or higher), Maximum allowable number of reflow processes: 3,
Exposure limit
Note
: 7 days (10 to 72 hours pre-backing is required at 125C°
afterwards),
Flux: Rosin flux with low chlorine (0.2 Wt% or below) recommended.
<Caution>
Non-heat-resistant trays, such as magazine and taping trays, cannot be baked
before unpacking.
IR60-107-3
Note The Maximum number of days during which the product can be stored at a temperature of 5 to 25°C and a
relative humidity of 20 to 65% after dry-pack package is opened.
<R>
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相关代理商/技术参数 |
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|---|---|
| UPD720112GK-9EU | 制造商: 功能描述: 制造商:NEC Electronics Corporation 功能描述: 制造商:undefined 功能描述: |
| UPD720113GK-9EU-A | 功能描述:IC HUB CTLR USB2.0 7-PORTS QFP RoHS:是 类别:集成电路 (IC) >> 接口 - 控制器 系列:- 标准包装:4,900 系列:- 控制器类型:USB 2.0 控制器 接口:串行 电源电压:3 V ~ 3.6 V 电流 - 电源:135mA 工作温度:0°C ~ 70°C 安装类型:表面贴装 封装/外壳:36-VFQFN 裸露焊盘 供应商设备封装:36-QFN（6x6） 包装:* 其它名称:Q6396337A |
| UPD720114GA-9EU-A | 制造商:Renesas Electronics Corporation 功能描述:I/O Controller USB Controller 48-Pin TQFP 制造商:NEC Electronics Corporation 功能描述:HUB CONTROLLER 4 PORT USB TQFP48 |
| UPD720114GA-YEU-A | 功能描述:HOST CTLR USB 2.0 48-TQFP RoHS:是 类别:集成电路 (IC) >> 接口 - 控制器 系列:ECOUSB™ 标准包装:2,450 系列:- 控制器类型:SPI 总线至 I²C 总线桥接 接口:I²C，串行，SPI 电源电压:2.4 V ~ 3.6 V 电流 - 电源:11mA 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:24-VFQFN 裸露焊盘 供应商设备封装:24-HVQFN（4x4） 包装:托盘 配用:568-3511-ND - DEMO BOARD SPI TO I2C 其它名称:935286452157SC18IS600IBSSC18IS600IBS-ND |
| UPD720114GA-YEU-ATR | 制造商:Renesas Electronics Corporation 功能描述:I/O CNTRLR USB CNTRLR 48TQFP - Trays |
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