- 您现在的位置：买卖IC网 > PDF目录200645 > UPD780023AYCW(A)-XXX 8-BIT, MROM, 12 MHz, MICROCONTROLLER, PDIP64 PDF资料下载
参数资料
| 型号： | UPD780023AYCW(A)-XXX |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 8-BIT, MROM, 12 MHz, MICROCONTROLLER, PDIP64 |
| 封装： | 0.750 INCH, PLASTIC, SDIP-64 |
| 文件页数： | 82/92页 |
| 文件大小： | 689K |
| 代理商： | UPD780023AYCW(A)-XXX |
第1页第2页第3页第4页第5页第6页第7页第8页第9页第10页第11页第12页第13页第14页第15页第16页第17页第18页第19页第20页第21页第22页第23页第24页第25页第26页第27页第28页第29页第30页第31页第32页第33页第34页第35页第36页第37页第38页第39页第40页第41页第42页第43页第44页第45页第46页第47页第48页第49页第50页第51页第52页第53页第54页第55页第56页第57页第58页第59页第60页第61页第62页第63页第64页第65页第66页第67页第68页第69页第70页第71页第72页第73页第74页第75页第76页第77页第78页第79页第80页第81页当前第82页第83页第84页第85页第86页第87页第88页第89页第90页第91页第92页
83
PD780021A(A), 780022A(A), 780023A(A), 780024A(A), 780021AY(A), 780022AY(A), 780023AY(A), 780024AY(A)
Data Sheet U15131EJ3V0DS
Table 14-1. Surface Mounting Type Soldering Conditions (2/2)
(3)
PD780021AGK(A)-×××
×××
×××-9ET: 64-pin plastic TQFP (12 x 12)
PD780022AGK(A)-×××
×××
×××-9ET: 64-pin plastic TQFP (12 x 12)
PD780023AGK(A)-×××
×××
×××-9ET: 64-pin plastic TQFP (12 x 12)
PD780024AGK(A)-×××
×××
×××-9ET: 64-pin plastic TQFP (12 x 12)
Soldering Method
Soldering Conditions
Recommended
Condition Symbol
Infrared reflow
Package peak temperature: 235
°C, Time: 30 seconds max.
IR35-107-2
(at 210
°C or higher), Count: Two times or less, Exposure limit:
7 daysNote (after that, prebake at 125
°C for 10 hours)
VPS
Package peak temperature: 215
°C, Time: 40 seconds max.
VP15-107-2
(at 200
°C or higher), Count: Two times or less, Exposure limit:
7 daysNote (after that, prebake at 125
°C for 10 hours)
Wave soldering
Solder bath temperature: 260
°C max., Time: 10 seconds max.,
WS60-107-1
Count: Once, Preheating temperature: 120
°C Max. (package surface
temperature), Exposure limit: 7 daysNote (after that, prebake at 125
°C
for 10 hours)
Partial heating
Pin temperature: 300
°C max., Time: 3 seconds max. (per pin row)
—
Note
After opening the dry pack, store it at 25
°C or less and 65%RH or less for the allowable storage period.
Caution Do not use different soldering methods together (except for partial heating).
Table 14-2. Insertion Type Soldering Conditions
PD780021ACW(A)-×××
×××
×××: 64-pin plastic SDIP (19.05 mm (750))
PD780022ACW(A)-×××
×××
×××: 64-pin plastic SDIP (19.05 mm (750))
PD780023ACW(A)-×××
×××
×××: 64-pin plastic SDIP (19.05 mm (750))
PD780024ACW(A)-×××
×××
×××: 64-pin plastic SDIP (19.05 mm (750))
Soldering Method
Soldering Conditions
Wave soldering
Solder bath temperature: 260
°C max., Time: 10 seconds max.
(only for pins)
Partial heating
Pin temperature: 300
°C max., Time: 3 seconds max. (per pin row)
Caution Apply wave soldering only to the pins and be careful not to bring solder into direct contact with
the package.
相关PDF资料 |
PDF描述 |
|---|---|
| UPD780032AGC-XXX-8BS-A | 8-BIT, MROM, 12 MHz, MICROCONTROLLER, PQFP64 |
| UPD78F0034BGB-8EU-A | 8-BIT, FLASH, 12 MHz, MICROCONTROLLER, PQFP64 |
| UPD780134GB-XXX-8EU | 8-BIT, MROM, 10 MHz, MICROCONTROLLER, PQFP64 |
| UPD780134GC-XXX-8BS | 8-BIT, MROM, 10 MHz, MICROCONTROLLER, PQFP64 |
| UPD780308GF(A)-XXX-3BA | 8-BIT, MROM, 5 MHz, MICROCONTROLLER, PQFP100 |
相关代理商/技术参数 |
参数描述 |
|---|---|
| UPD780024AGK-C42-9ET | 制造商:Renesas Electronics Corporation 功能描述: |
| UPD780024AGK-C93-9ET | 制造商:Renesas Electronics Corporation 功能描述: |
| UPD780033AGK-B03-9ET | 制造商:Renesas Electronics Corporation 功能描述: |
| UPD780033AGK-B03-9ET-A | 制造商:Renesas Electronics Corporation 功能描述: |
| UPD780034AGC-119-8BS-A | 制造商:Renesas Electronics Corporation 功能描述:NECUPD780034AGC-119-8BS-A MCU |
发布紧急采购，3分钟左右您将得到回复。