参数资料
型号: V048F096T25
元件分类: 模拟信号调理
英文描述: SPECIALTY ANALOG CIRCUIT, XMA
封装: ROHS COMPLIANT, SMD
文件页数: 10/11页
文件大小: 955K
代理商: V048F096T25
vicorpower.com
800-735-6200
VI Chip Voltage Transformation Module
V048F096T025
Rev. 2.3
Page 8 of 11
VI Chip Voltage Transformation Module
2.95±0.07
[0.116±0.003]
NON-PLATED
THROUGH HOLE
SEE NOTE 1.
(2) PL
(4.37)
0.172
(11.37)
0.448
(7.00)
0.276
(36.50)
1.437
(18.25)
0.719
(2.510)
0.099
(31.48)
1.240
(39.50)
1.555
SEE NOTE 2.
DOTTED LINE
INDICATES VIC
POSITION
SEE NOTE 3
HEAT SINK PUSH-PIN HOLE PATTERN
( TOP SIDE SHOWN )
SEE NOTE 3
inch
(mm)
.
NOTES:
1. MAINTAIN 3.5/[0.138] DIA. KEEP OUT ZONE FREE OF
COPPER. ALL PCB LAYERS.
2. MINIMUM RECOMMENDED PITCH IS 39.50/[1.555].
THIS PROVIDES 7.00/[0.276] COMPONENT EDGE-TO-EDGE SPACING.
AND 0.50/[0.020] CLEARANCE BETWEEN VICOR HEAT SINKS.
3. VI CHIP LAND PATTERN SHOWN FOR REFERENCE ONLY;
ACTUAL LAND PATTERN MAY DIFFER.
DIMENSIONS FROM EDGES OF LAND PATTERN TO PUSH-PIN
HOLES WILL BE THE SAME FOR ALL FULL SIZE VI CHIPS.
4. DIMENSION ARE
Figure 14 — Hole location for push pin heat sink relative to VI Chip
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