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参数资料
| 型号： | V048F096T25 |
| 元件分类： | 模拟信号调理 |
| 英文描述： | SPECIALTY ANALOG CIRCUIT, XMA |
| 封装： | ROHS COMPLIANT, SMD |
| 文件页数： | 6/11页 |
| 文件大小： | 955K |
| 代理商： | V048F096T25 |
vicorpower.com
800-735-6200
VI Chip Voltage Transformation Module
V048F096T025
Rev. 2.3
Page 4 of 11
VI Chip Voltage Transformation Module
Parameter
Min
Typ
Max
Unit
Note
Primary Control (PC)
DC voltage
4.8
5.0
5.2
Vdc
Module disable voltage
2.4
2.5
Vdc
Module enable voltage
2.5
2.6
Vdc
VC voltage must be applied when module is enabled using PC
Current limit
2.4
2.5
2.9
mA
Source only
Disable delay time
20
s
PC low to Vout low
VTM Control (VC)
External boost voltage
12
14
19
Vdc
Required for VTM start up without PRM
External boost duration
10
ms
Vin > 32 Vdc. VC must be applied continuously
if Vin < 32 Vdc.
Auxiliary Pins (Conditions are at 48 Vin, full load, and 25°C ambient unless otherwise specified)
Figure 7 — 0-25 A load step with 100 F input capacitance and no output
capacitance.
Figure 8 — 25-0 A load step with 100 F input capacitance and no output
capacitance.
Electrical Specifications (continued)
Parameter
Min
Typ
Max
Unit
Note
MTBF
MIL-HDBK-217F
3.5
Mhrs
25°C, GB
Isolation specifications
Voltage
2,250
Vdc
Input to output
Capacitance
3,000
pF
Input to output
Resistance
10
MΩ
Input to output
Agency approvals
cTVus
UL /CSA 60950-1, EN 60950-1
CE Mark
Low voltage directive
RoHS
Mechanical
See Mechanical Drawings, Figures 10 – 13
Weight
0.53/15
oz /g
Dimensions
Length
1.28/ 32,5
in / mm
Width
0.87 / 22
in / mm
Height
0.26/ 6,6
in / mm
Thermal
Over temperature shutdown
125
130
135
°C
Junction temperature
Thermal capacity
9.3
Ws /°C
Junction-to-case thermal impedance (RθJC)1.1
°C / W
Junction-to-board thermal impedance (RθJB)2.1
°C / W
General
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