参数资料
型号: V58C2256404SHLM5I
厂商: PROMOS TECHNOLOGIES INC
元件分类: DRAM
英文描述: 64M X 4 DDR DRAM, PBGA60
封装: GREEN, MO-233, BGA-60
文件页数: 11/60页
文件大小: 1125K
代理商: V58C2256404SHLM5I
19
ProMOS TECHNOLOGIES
V58C2256(804/404/164)SH
V58C2256(804/404/164)SH Rev. 1.1 July 2010
Read Interrupted by a Precharge
A Burst Read operation can be interrupted by a precharge of the same bank. The Precharge command to
Output Disable latency is equivalent to the CAS latency.
Read Interrupted by a Precharge Timing
Burst Write Operation
The Burst Write command is issued by having CS, CAS, and WE low while holding RAS high at the rising
edge of the clock. The address inputs determine the starting column address. The memory controller is re-
quired to provide an input data strobe (DQS) to the DDR SDRAM to strobe or latch the input data (DQ) and
data mask (DM) into the device. During Write cycles, the data strobe applied to the DDR SDRAM is required
to be nominally centered within the data (DQ) and data mask (DM) valid windows. The data strobe must be
driven high nominally one clock after the write command has been registered. Timing parameters tDQSS(min)
and tDQSS(max) define the allowable window when the data strobe must be driven high.
Input data for the first Burst Write cycle must be applied one clock cycle after the Write command is
registered into the device (WL=1). The input data valid window is nominally centered around the midpoint of
the data strobe signal. The data window is defined by DQ to DQS setup time (tQDQSS) and DQ to DQS hold
time (tQDQSH). All data inputs must be supplied on each rising and falling edge of the data strobe until the burst
length is completed. When the burst has finished, any additional data supplied to the DQ pins will be ignored.
Write Preamble and Postamble Operation
Prior to a burst of write data and given that the controller is not currently in burst write mode, the data strobe
signal (DQS), must transition from Hi-Z to a valid logic low. This is referred to as the data strobe “write preamble”.
This transition from Hi-Z to logic low nominally happens on the falling edge of the clock after the write com-
mand has been registered by the device. The preamble is explicitly defined by a setup time (tWPRES(min)) and
hold time (tWPREH(min)) referenced to the first falling edge of CK after the write command.
T0
T1
T2
T3
T4
T5
T6
T7
T8
D0
D1
D2
D3
NOP
Read
NOP
PreA
NOP
BA
NOP
CK, CK
Command
DQS
DQ
tRAS(min)
tRP(min)
BA
NOP
T9
D0
D1
D2
D3
DQS
DQ
CAS Latency=2
CAS Latency=2.5
(CAS Latency = 2, 2.5; Burst Length = 4)
相关PDF资料
PDF描述
V58C2256404SHLZ4E 64M X 4 DDR DRAM, PBGA60
V58C2256404SHUR5 64M X 4 DDR DRAM, PBGA60
V58C2256804SHLI4I 32M X 8 DDR DRAM, PDSO66
V58C2256804SHLJ6E 32M X 8 DDR DRAM, PBGA60
V58C2256804SHLS6I 32M X 8 DDR DRAM, PBGA60
相关代理商/技术参数
参数描述
V58C2256804S 制造商:MOSEL 制造商全称:MOSEL 功能描述:HIGH PERFORMANCE 2.5 VOLT 256 Mbit DDR SDRAM
V58C2256804SAT-5 制造商:Mosel Vitelic Corporation 功能描述:SDRAM, DDR, 32M x 8, 66 Pin, Plastic, TSSOP
V58C265164S 制造商:MOSEL 制造商全称:MOSEL 功能描述:64 Mbit DDR SDRAM 2.5 VOLT 4M X 16
V58C265404S 制造商:MOSEL 制造商全称:MOSEL 功能描述:HIGH PERFORMANCE 2.5 VOLT 16M X 4 DDR SDRAM 4 BANKS X 4Mbit X 4
V58C265804S 制造商:MOSEL 制造商全称:MOSEL 功能描述:HIGH PERFORMANCE 2.5 VOLT 8M X 8 DDR SDRAM 4 BANKS X 2Mbit X 8