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| 型号： | VJ0805Y223KXBBC31 |
| 厂商： | Vishay Vitramon |
| 文件页数： | 19/21页 |
| 文件大小： | 0K |
| 描述： | CAP CER 0.022UF 100V X7R 0805 |
| 特色产品： | Automotive Multilayer Ceramic Chip Capacitors |
| 标准包装： | 1 |
| 系列： | VJ |
| 电容： | 0.022µF |
| 电压 - 额定： | 100V |
| 容差： | ±10% |
| 温度系数： | X7R |
| 安装类型： | 表面贴装，MLCC |
| 工作温度： | -55°C ~ 150°C |
| 应用： | 自动 |
| 额定值： | AEC-Q200 |
| 封装/外壳： | 0805（2012 公制） |
| 尺寸/尺寸： | 0.079" L x 0.049" W（2.00mm x 1.25mm） |
| 厚度（最大）： | 0.057"（1.45mm） |
| 包装： | 标准包装 |
| 其它名称： | 720-1268-6 |
VJ....31/VJ....34 Automotive MLCC
www.vishay.com
6.4 MOUNTING, DIMENSIONS AND TESTING
Mountin g
Printe d boar d
S MD un d er test
1.6 ± 0.1
Vishay Vitramon
before test
R= 3
+
45 ± 2
+
S ol d er
S upport
90 ± 1
Testin g
20
Material: Aluminum
Wi d th
Wi d th = actual wi d th
of substrate + 5 mm
on both si d es
Ra d ius
1 to 2
Printe d boar d
10 ± 0.1
1.5 ± 0.1
d urin g test
+
+
0
All d imensions in mm
6.5 PERFORMANCE OF THE TEST(S)
A) Electrical test according to component specification (Cap, DF, IR)
B) Mounting to PCB
C) Storage at room temperature (min. 10 h)
D) Board flex test
6.6 DETAILS
X7R, X8R
C0G
PCB to be deflected continuously, speed 1 mm/s (± 0.5 mm/s)
PCB to be deflected in steps untill cracks or other damages are visible or can be measured. Dwell time between
steps: (5 ± 1) s
6.7 FAILURE CRITERIA
X7R, X8R
C0G
Both
PCB to be deflected continuously, speed 1 mm/s (± 0.5 mm/s)
PCB to be deflected in steps untill cracks or other damages are visible or can be measured. Dwell time between
steps: (5 ± 1) s
PCB to be deflected continuously, speed 1 mm/s (± 0.5 mm/s)
Revision: 12-Feb-14
19
Document Number: 45040
For technical questions, contact: mlcc@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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相关代理商/技术参数 |
参数描述 |
|---|---|
| VJ0805Y223KXBCW1BC | 功能描述:多层陶瓷电容器MLCC - SMD/SMT 0805 0.022uF 100volts X7R 10% RoHS:否 制造商:American Technical Ceramics (ATC) 电容:10 pF 容差:1 % 电压额定值:250 V 温度系数/代码:C0G (NP0) 外壳代码 - in:0505 外壳代码 - mm:1414 工作温度范围:- 55 C to + 125 C 产品:Low ESR MLCCs 封装:Reel |
| VJ0805Y223KXBMB | 功能描述:多层陶瓷电容器MLCC - SMD/SMT 0805 0.022uF 100volts X7R 10% RoHS:否 制造商:American Technical Ceramics (ATC) 电容:10 pF 容差:1 % 电压额定值:250 V 温度系数/代码:C0G (NP0) 外壳代码 - in:0505 外壳代码 - mm:1414 工作温度范围:- 55 C to + 125 C 产品:Low ESR MLCCs 封装:Reel |
| VJ0805Y223KXBMC | 功能描述:多层陶瓷电容器MLCC - SMD/SMT .022UF 100V 10% RoHS:否 制造商:American Technical Ceramics (ATC) 电容:10 pF 容差:1 % 电压额定值:250 V 温度系数/代码:C0G (NP0) 外壳代码 - in:0505 外壳代码 - mm:1414 工作温度范围:- 55 C to + 125 C 产品:Low ESR MLCCs 封装:Reel |
| VJ0805Y223KXBMP | 制造商:Vishay Vitramon 功能描述:CAP .022UF 100V X7R 10% SMD 0805 - Tape and Reel |
| VJ0805Y223KXBMR | 功能描述:多层陶瓷电容器MLCC - SMD/SMT 0805 0.022uF 100volts X7R 10% RoHS:否 制造商:American Technical Ceramics (ATC) 电容:10 pF 容差:1 % 电压额定值:250 V 温度系数/代码:C0G (NP0) 外壳代码 - in:0505 外壳代码 - mm:1414 工作温度范围:- 55 C to + 125 C 产品:Low ESR MLCCs 封装:Reel |
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