参数资料
型号: VS8061QH
厂商: VITESSE SEMICONDUCTOR CORP
元件分类: 通信及网络
英文描述: SPECIALTY TELECOM CIRCUIT, PQFP52
封装: PLASTIC, QFP-52
文件页数: 8/20页
文件大小: 409K
代理商: VS8061QH
VITESSE
SEMICONDUCTOR CORPORATION
Datasheet
VSC8061/VSC8062
2.5 Gb/s 16-Bit Multiplexer/
Demultiplexer Chipset
Page 16
VITESSE SEMICONDUCTOR CORPORATION
741 Calle Plano, Camarillo, CA 93012 805/388-3700 FAX: 805/987-5896
6/22/99
G52069-0, Rev. 4.1
Thermal Considerations
The VS8061 and VS8062 are available in ceramic LDCC and thermally enhanced plastic quad flatpacks.
These packages have been enhanced to improve thermal dissipation through low thermal resistance paths from
the die to the exposed surface of the heat spreader. The thermal resistance of the two packages is shown in the
following table
Table 7: Thermal Resistance
Thermal Resistance with Airflow
Shown in the table below is the thermal resistance with airflow. This thermal resistance value reflects all the
thermal paths including through the leads in an environment where the leads are exposed. The temperature dif-
ference between the ambient airflow temperature and the case temperature should be the worst case power of
the device multiplied by the thermal resistance.
Table 8: Thermal Resistance with Airflow
Thermal Resistance with Heat Sink
The determination of appropriate heat sink to use is as shown below, using the VS8061 in QH package as an
example.
Figure 11: VS8061 in QH Package
Symbol
Description
F Pack
QH Pack
Units
θ
jc
Thermal resistance from
junction to case.
1.3
2.1
°C/W
θ
ca
Thermal resistance from case to
ambient still air including
conduction through the leads.
18.5
30.0
°C/W
Airflow
θ
ca for F Pack
(case to ambient)
θ
ca for QH Pack
Units
100 lfpm
15.9
24
oC/W
200 lfpm
14.9
21
oC/W
300 lfpm
14.2
19
oC/W
500 lfpm
13.3
15
oC/W
θ
SA
θ
CS
T
A
相关PDF资料
PDF描述
VS8062QH SPECIALTY TELECOM CIRCUIT, PQFP52
VS8061FI SPECIALTY TELECOM CIRCUIT, CQFP52
VS8061FC SPECIALTY TELECOM CIRCUIT, CQFP52
VS8062FI SPECIALTY TELECOM CIRCUIT, CQFP52
VS8062FC SPECIALTY TELECOM CIRCUIT, CQFP52
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