参数资料
型号: W24L11Q-55LL
厂商: WINBOND ELECTRONICS CORP
元件分类: SRAM
英文描述: 128K X 8 STANDARD SRAM, 55 ns, PDSO32
封装: 8 X 13.40 MM, TSOP1-32
文件页数: 12/12页
文件大小: 247K
代理商: W24L11Q-55LL
W24L11
Publication Release Date: August 7, 2001
- 9 -
Revision A4
BONDING PAD DIAGRAM
X
Y
A16
A14
A12
A7
A6
A4
A11
A8
A13
WEB
VDD
7
A5
CS2
A9
OEB
24
3
4
5
6
2
30
31
1
32
28
29
27
26
25
A15
33
17
18
19
A1
A0
I/O0 I/O1
VSS VSS
I/O4 I/O5 I/O6
20
A2
12
13
14
15
10
11
21
CS1B
16
I/O7
I/O3
22
A10
23
I/O2
9
A3
8
AC5405
PAD NO.
X
Y
1
-485.31
2376.64
2
-1200.87
2376.64
3
-1341.05
2376.64
4
-1480.80
2376.64
5
-1622.21
2376.64
6
-1767.47
2376.64
7
-1993.03
2228.49
8
-1990.55
-2275.79
9
-1789.57
-2382.05
10
-1556.20
-2382.05
11
-1405.83
-2382.05
12
-1169.73
-2383.00
13
-870.28
-2383.00
14
-567.65
-2383.00
15
-336.94
-2385.00
16
-112.55
-2385.00
17
224.85
-2383.00
18
497.55
-2383.00
19
772.25
-2383.00
20
1044.95
-2383.00
21
1319.65
-2383.00
22
1537.77
-2382.05
23
1773.94
-2382.05
24
1985.78
-2297.62
25
1987.47
2221.27
26
1669.63
2376.64
27
1451.03
2376.64
28
1196.59
2376.64
29
956.65
2376.64
30
219.67
2376.64
31
79.47
2376.64
32
-145.06
2343.58
33
-353.56
2343.58
Note: For bare chip form (C.O.B.) applications, the substrate must be connected to VDD or left floating in the PCB layout.
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相关代理商/技术参数
参数描述
W24L11Q-70L 制造商:WINBOND 制造商全称:Winbond 功能描述:128K X 8 High Speed CMOS Static RAM
W24L11Q-70LE 制造商:未知厂家 制造商全称:未知厂家 功能描述:x8 SRAM
W24L11Q-70LL 制造商:WINBOND 制造商全称:Winbond 功能描述:128K X 8 High Speed CMOS Static RAM
W24L11S-70L 制造商:WINBOND 制造商全称:Winbond 功能描述:128K X 8 High Speed CMOS Static RAM
W24L11S-70LE 制造商:未知厂家 制造商全称:未知厂家 功能描述:x8 SRAM