参数资料
型号: W25Q16CLSSIG
厂商: WINBOND ELECTRONICS CORP
元件分类: PROM
英文描述: 16M X 1 SPI BUS SERIAL EEPROM, PDSO8
封装: 0.208 INCH, GREEN, PLASTIC, SOIC-8
文件页数: 60/77页
文件大小: 2458K
代理商: W25Q16CLSSIG
W25Q16CL
Publication Release Date: July 08, 2010
- 63 -
Preliminary - Revision A
12.3 Power-up Timing and Write Inhibit Threshold
SPEC
PARAMETER
SYMBOL
MIN
MAX
UNIT
VCC (min) to /CS Low
tVSL(1)
10
s
Time Delay Before Write Instruction
tPUW(1)
1
10
ms
Write Inhibit Threshold Voltage
VWI(1)
1.0
2.0
V
Note:
1. These parameters are characterized only.
Figure 38. Power-up Timing and Voltage Levels
相关PDF资料
PDF描述
W25Q40BWUXIG 4M X 1 SPI BUS SERIAL EEPROM, PDSO8
WF128K32NA-200HM 512K X 8 FLASH 12V PROM MODULE, 200 ns, CHIP66
WS512K32N-45HI 2M X 8 MULTI DEVICE SRAM MODULE, 45 ns, CHIP66
WF128K32-70G4M5 512K X 8 FLASH 5V PROM MODULE, 70 ns, CQFP68
WPS1M32-25MSCT 4M X 8 MULTI DEVICE SRAM MODULE, 25 ns, SMA72
相关代理商/技术参数
参数描述
W25Q16CLSSIP 制造商:WINBOND 制造商全称:Winbond 功能描述:2.5V 16M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI
W25Q16CLZPIG 制造商:WINBOND 制造商全称:Winbond 功能描述:2.5V 16M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI
W25Q16CLZPIP 制造商:WINBOND 制造商全称:Winbond 功能描述:2.5V 16M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI
W25Q16CV 制造商:WINBOND 制造商全称:Winbond 功能描述:3V 16M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI
W25Q16CVDAAG 制造商:WINBOND 制造商全称:Winbond 功能描述:3V 16M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI