参数资料
型号: W25Q16CVSFIG
厂商: Winbond Electronics
文件页数: 6/81页
文件大小: 0K
描述: IC SPI FLASH 16MBIT 16SOIC
标准包装: 44
系列: SpiFlash®
格式 - 存储器: 闪存
存储器类型: FLASH
存储容量: 16M(2M x 8)
速度: 104MHz
接口: SPI 串行
电源电压: 2.7 V ~ 3.6 V
工作温度: -40°C ~ 85°C
封装/外壳: 16-SOIC(0.295",7.50mm 宽)
供应商设备封装: 16-SOIC
包装: 管件
其它名称: W25Q16CVSFIG-ND
W25Q16CVSFIGS
W25Q16CV
3. PACKAGE TYPES AND PIN CONFIGURATIONS
W25Q16CV is offered in an 8-pin SOIC 150-mil or 208-mil (package code SN & SS), an 8-pin VSOP 150-
mil or 208-mil (package code SV & ST), an 8-pad WSON 6x5-mm (package code ZP), an 8-pin PDIP
300-mil (package code DA), a 16-pin SOIC 300-mil (package code SF) and a 24-ball 8x6-mm TFBGA
(5x5 ball array - package code TB, 6x4 ball array – package code TC) as shown in Figure 1a-e
respectively. Package diagrams and dimensions are illustrated at the end of this datasheet.
3.1 Pin Configuration SOIC / VSOP 150 / 208-mil
Top View
/CS
DO (IO 1 )
/WP (IO 2 )
GND
1
2
3
4
8
7
6
5
VCC
/HOLD (IO 3 )
CLK
DI (IO 0 )
Figure 1a. W25Q16CV Pin Assignments, 8-pin SOIC / VSOP 150 / 208-mil (Package Code SN, SS, SV, ST)
3.2
Pad Configuration WSON 6x5-mm
Top View
/CS
DO (IO 1 )
/WP (IO 2 )
GND
1
2
3
4
8
7
6
5
VCC
/HOLD (IO 3 )
CLK
DI (IO 0 )
Figure 1b. W25Q16CV Pad Assignments, 8-pad WSON 6x5-mm (Package Code ZP)
-6-
相关PDF资料
PDF描述
W25Q16DWSFIG IC FLASH SPI 16MBIT 16SOIC
W25Q16VSFIG IC FLASH 16MBIT 80MHZ 16SOIC
W25Q32BVZPIG IC SPI FLASH 32MBIT 8WSON
W25Q32DWZEIG IC FLASH SPI 32MBIT 8WSON
W25Q40BWSSIG IC FLASH SPI 4MBIT 8SOIC
相关代理商/技术参数
参数描述
W25Q16CVSFIP 制造商:WINBOND 制造商全称:Winbond 功能描述:3V 16M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI
W25Q16CVSNAG 制造商:WINBOND 制造商全称:Winbond 功能描述:3V 16M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI
W25Q16CVSNAP 制造商:WINBOND 制造商全称:Winbond 功能描述:3V 16M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI
W25Q16CVSNIG 制造商:WINBOND 制造商全称:Winbond 功能描述:3V 16M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI
W25Q16CVSNIP 制造商:WINBOND 制造商全称:Winbond 功能描述:3V 16M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI