参数资料
型号: W25Q16CVTCIP
厂商: WINBOND ELECTRONICS CORP
元件分类: PROM
英文描述: 16M X 1 SPI BUS SERIAL EEPROM, PBGA24
封装: 8 X 6 MM, GREEN, TFBGA-24
文件页数: 48/79页
文件大小: 1131K
代理商: W25Q16CVTCIP
W25Q16CV
- 52 -
7.2.31 Read Manufacturer / Device ID (90h)
The Read Manufacturer/Device ID instruction is an alternative to the Release from Power-down / Device
ID instruction that provides both the JEDEC assigned manufacturer ID and the specific device ID.
The Read Manufacturer/Device ID instruction is very similar to the Release from Power-down / Device ID
instruction. The instruction is initiated by driving the /CS pin low and shifting the instruction code “90h”
followed by a 24-bit address (A23-A0) of 000000h. After which, the Manufacturer ID for Winbond (EFh)
and the Device ID are shifted out on the falling edge of CLK with most significant bit (MSB) first as shown
in Figure 29. The Device ID values for the W25Q16CV is listed in Manufacturer and Device Identification
table. If the 24-bit address is initially set to 000001h the Device ID will be read first and then followed by
the Manufacturer ID. The Manufacturer and Device IDs can be read continuously, alternating from one to
the other. The instruction is completed by driving /CS high.
/CS
CLK
DI
(IO
0)
DO
(IO
1)
Mode 0
Mode 3
0
1
2
3
4
5
6
7
Instruction (90h)
High Impedance
8
9
10
28
29
30
31
Address (000000h)
23
22
21
3
2
1
0
Device ID
(IO
1)
*
/CS
CLK
DI
(IO
0)
DO
32
33
34
35
36
37
38
39
40
41
42
44
45
46
7
6
5
4
3
2
1
0
*
Manufacturer ID (EFh)
43
31
0
Mode 0
Mode 3
= MSB
*
Figure 29. Read Manufacturer / Device ID Diagram
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相关代理商/技术参数
参数描述
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