参数资料
型号: W25Q32BVDAAP
厂商: WINBOND ELECTRONICS CORP
元件分类: PROM
英文描述: 32M X 1 SPI BUS SERIAL EEPROM, PDIP8
封装: 0.300 INCH, GREEN, PLASTIC, DIP-8
文件页数: 78/79页
文件大小: 1090K
代理商: W25Q32BVDAAP
W25Q32BV
- 8 -
3.5 Pin Configuration SOIC 300-mil
1
2
3
4
/CS
DO (IO
1)/WP (IO2)
GND
VCC
/HOLD (IO
3)
DI (IO
0)
CLK
Top View
NC
5
6
7
8
10
9
11
12
13
14
15
16
Figure 1d. W25Q32BV Pin Assignments, 16-pin SOIC 300-mil (Package Code SF)
3.6 Pin Description SOIC 300-mil
PIN NO.
PIN NAME
I/O
FUNCTION
1
/HOLD (IO3)
I/O
Hold Input (Data Input Output 3)*
2
VCC
Power Supply
3
N/C
No Connect
4
N/C
No Connect
5
N/C
No Connect
6
N/C
No Connect
7
/CS
I
Chip Select Input
8
DO (IO1)
I/O
Data Output (Data Input Output 1)*
1
9
/WP (IO2)
I/O
Write Protect Input (Data Input Output 2)*
2
10
GND
Ground
11
N/C
No Connect
12
N/C
No Connect
13
N/C
No Connect
14
N/C
No Connect
15
DI (IO0)
I/O
Data Input (Data Input Output 0)*
1
16
CLK
I
Serial Clock Input
*1 IO0 and IO1 are used for Standard and Dual SPI instructions
*2 IO0 – IO3 are used for Quad SPI instructions
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