参数资料
型号: W25Q32BWSSIG
厂商: WINBOND ELECTRONICS CORP
元件分类: PROM
英文描述: 4M X 8 SPI BUS SERIAL EEPROM, PDSO8
封装: 0.208 INCH, GREEN, PLASTIC, SOIC-8
文件页数: 59/72页
文件大小: 2212K
代理商: W25Q32BWSSIG
W25Q32BW
- 62 -
11.7 AC Electrical Characteristics (cont’d)
SPEC
DESCRIPTION
SYMBOL
ALT
MIN
TYP
MAX
UNIT
/HOLD Active Hold Time relative to CLK
tCHHH
5
ns
/HOLD Not Active Setup Time relative to CLK
tHHCH
5
ns
/HOLD Not Active Hold Time relative to CLK
tCHHL
5
ns
/HOLD to Output Low-Z
tHHQX(2)
tLZ
7
ns
/HOLD to Output High-Z
tHLQZ(2)
tHZ
12
ns
Write Protect Setup Time Before /CS Low
tWHSL(3)
20
ns
Write Protect Hold Time After /CS High
tSHWL(3)
100
ns
/CS High to Power-down Mode
tDP(2)
3
s
/CS High to Standby Mode without Electronic
Signature Read
tRES1(2)
30
s
/CS High to Standby Mode with Electronic Signature
Read
tRES2(2)
30
s
/CS High to next Instruction after Suspend
tSUS(2)
20
s
Write Status Register Time
tW
10
15
ms
Byte Program Time (First Byte) (4)
tBP1
20
50
s
Additional Byte Program Time (After First Byte) (4)
tBP2
2.5
10
s
Page Program Time
tPP
0.7
3
ms
Sector Erase Time (4KB)
tSE
30
200
ms
Block Erase Time (32KB)
tBE1
120
800
ms
Block Erase Time (64KB)
tBE2
150
1,000
ms
Chip Erase Time
tCE
5
15
s
Notes:
1.
Clock high + Clock low must be less than or equal to 1/fC.
2.
Value guaranteed by design and/or characterization, not 100% tested in production.
3.
Only applicable as a constraint for a Write Status Register instruction when SRP0 bit is set to 1.
4.
For multiple bytes after first byte within a page,
tBPN = tBP1 + tBP2 * N (typical) and tBPN = tBP1 + tBP2 * N (max), where N =
number of bytes programmed.
相关PDF资料
PDF描述
W25Q40BWSNIP 4M X 1 SPI BUS SERIAL EEPROM, PDSO8
W25Q64BVSSIP 8M X 8 SPI BUS SERIAL EEPROM, PDSO8
W25Q64CVZPAG 64M X 1 SPI BUS SERIAL EEPROM, PDSO8
W25Q64CVZEAG 64M X 1 SPI BUS SERIAL EEPROM, PDSO8
W25Q64CVDAIG 64M X 1 SPI BUS SERIAL EEPROM, PDIP8
相关代理商/技术参数
参数描述
W25Q32DW 制造商:WINBOND 制造商全称:Winbond 功能描述:1.8V 32M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI
W25Q32DWSFIG 功能描述:IC FLASH SPI 32MBIT 16SOIC RoHS:是 类别:集成电路 (IC) >> 存储器 系列:SpiFlash® 标准包装:2,500 系列:- 格式 - 存储器:EEPROMs - 串行 存储器类型:EEPROM 存储容量:1K (128 x 8) 速度:100kHz 接口:UNI/O?(单线) 电源电压:1.8 V ~ 5.5 V 工作温度:-40°C ~ 85°C 封装/外壳:8-TSSOP,8-MSOP(0.118",3.00mm 宽) 供应商设备封装:8-MSOP 包装:带卷 (TR)
W25Q32DWSFIP 制造商:WINBOND 制造商全称:Winbond 功能描述:1.8V 32M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI
W25Q32DWSSIG 功能描述:IC FLASH SPI 32MBIT 8SOIC RoHS:是 类别:集成电路 (IC) >> 存储器 系列:SpiFlash® 标准包装:2,500 系列:- 格式 - 存储器:EEPROMs - 串行 存储器类型:EEPROM 存储容量:1K (128 x 8) 速度:100kHz 接口:UNI/O?(单线) 电源电压:1.8 V ~ 5.5 V 工作温度:-40°C ~ 85°C 封装/外壳:8-TSSOP,8-MSOP(0.118",3.00mm 宽) 供应商设备封装:8-MSOP 包装:带卷 (TR)
W25Q32DWSSIP 制造商:WINBOND 制造商全称:Winbond 功能描述:1.8V 32M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI