参数资料
型号: W25Q64CVZEAG
厂商: WINBOND ELECTRONICS CORP
元件分类: PROM
英文描述: 64M X 1 SPI BUS SERIAL EEPROM, PDSO8
封装: 8 X 6 MM, GREEN, WSON-8
文件页数: 22/79页
文件大小: 1086K
代理商: W25Q64CVZEAG
W25Q64CV
Publication Release Date: April 01, 2011
- 29 -
Revision C
7.2.12 Fast Read Dual Output (3Bh)
The Fast Read Dual Output (3Bh) instruction is similar to the standard Fast Read (0Bh) instruction except
that data is output on two pins; IO0 and IO1. This allows data to be transferred from the W25Q64CV at
twice the rate of standard SPI devices. The Fast Read Dual Output instruction is ideal for quickly
downloading code from Flash to RAM upon power-up or for applications that cache code-segments to
RAM for execution.
Similar to the Fast Read instruction, the Fast Read Dual Output instruction can operate at the highest
possible frequency of FR (see AC Electrical Characteristics). This is accomplished by adding eight
“dummy” clocks after the 24-bit address as shown in Figure 11. The dummy clocks allow the device's
internal circuits additional time for setting up the initial address. The input data during the dummy clocks is
“don’t care”. However, the IO0 pin should be high-impedance prior to the falling edge of the first data out
clock.
/CS
CLK
DI
(IO
0)
DO
(IO
1)
Mode 0
Mode 3
0
1
2
3
4
5
6
7
Instruction (3Bh)
High Impedance
8
9
10
28
29
30
32
33
34
35
36
37
38
39
6
4
2
0
24-Bit Address
23
22
21
3
2
1
0
*
31
/CS
CLK
DI
(IO
0)
DO
(IO
1)
Dummy Clocks
0
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
7
5
3
1
6
4
2
0
6
4
2
0
6
4
2
0
High Impedance
7
5
3
1
7
5
3
1
7
5
3
1
IO
0 switches from
Input to Output
6
7
Data Out 1
* Data Out 2
* Data Out 3
* Data Out 4
= MSB
*
Figure 11. Fast Read Dual Output Instruction Sequence Diagram
相关PDF资料
PDF描述
W25Q64CVDAIG 64M X 1 SPI BUS SERIAL EEPROM, PDIP8
W25Q64DWZPIP 256K X 32 SPI BUS SERIAL EEPROM, 7.5 ns, PDSO8
W25Q80BLSNIG 8M X 1 SPI BUS SERIAL EEPROM, PDSO8
W25Q80BVZPAG 8M X 1 SPI BUS SERIAL EEPROM, PDSO8
W25Q80BVSNIP 8M X 1 SPI BUS SERIAL EEPROM, PDSO8
相关代理商/技术参数
参数描述
W25Q64CVZEAP 制造商:WINBOND 制造商全称:Winbond 功能描述:3V 64M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI
W25Q64CVZEIG 功能描述:IC SPI FLASH 64MBIT 8WSON RoHS:是 类别:集成电路 (IC) >> 存储器 系列:SpiFlash® 标准包装:150 系列:- 格式 - 存储器:EEPROMs - 串行 存储器类型:EEPROM 存储容量:4K (2 x 256 x 8) 速度:400kHz 接口:I²C,2 线串口 电源电压:2.5 V ~ 5.5 V 工作温度:-40°C ~ 85°C 封装/外壳:8-VFDFN 裸露焊盘 供应商设备封装:8-DFN(2x3) 包装:管件 产品目录页面:1445 (CN2011-ZH PDF)
W25Q64CVZEIP 制造商:WINBOND 制造商全称:Winbond 功能描述:3V 64M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI
W25Q64CVZPAG 制造商:WINBOND 制造商全称:Winbond 功能描述:3V 64M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI
W25Q64CVZPAP 制造商:WINBOND 制造商全称:Winbond 功能描述:3V 64M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI