参数资料
型号: W25Q64CVZPAP
厂商: WINBOND ELECTRONICS CORP
元件分类: PROM
英文描述: 64M X 1 SPI BUS SERIAL EEPROM, PDSO8
封装: 6 X 5 MM, GREEN, WSON-8
文件页数: 79/79页
文件大小: 1086K
代理商: W25Q64CVZPAP
W25Q64CV
Publication Release Date: April 01, 2011
- 9 -
Revision C
3.7 Ball Configuration TFBGA 8x6-mm
Top View
A1
NC
A2
A3
A4
NC
B1
VCC
GND
CLK
B2
B3
B4
NC
D1
/HOLD(IO
3)
DI(IO
0)
DO(IO
1)
/WP (IO
2)
D2
D3
D4
NC
E1
NC
E2
E3
E4
NC
F1
NC
F2
F3
F4
NC
C1
NC
/CS
C2
C3
C4
NC
Figure 1e. W25Q64CV Ball Assignments, 24-ball TFBGA 8x6-mm (Package Code TC)
3.8 Ball Description TFBGA 8x6-mm
BALL NO.
PIN NAME
I/O
FUNCTION
B2
CLK
I
Serial Clock Input
B3
GND
Ground
B4
VCC
Power Supply
C2
/CS
I
Chip Select Input
C4
/WP (IO2)
I/O
Write Protect Input (Data Input Output 2)*
2
D2
DO (IO1)
I/O
Data Output (Data Input Output 1)*
1
D3
DI (IO0)
I/O
Data Input (Data Input Output 0)*
1
D4
/HOLD (IO3)
I/O
Hold Input (Data Input Output 3)*
2
Multiple
NC
No Connect
*1 IO0 and IO1 are used for Standard and Dual SPI instructions
*2 IO0 – IO3 are used for Quad SPI instructions
相关PDF资料
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