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| 型号： | W25Q80BVSNIG |
| 厂商： | Winbond Electronics |
| 文件页数： | 2/75页 |
| 文件大小： | 0K |
| 描述： | IC SPI FLASH 8MBIT 8SOIC |
| 标准包装： | 100 |
| 系列： | SpiFlash® |
| 格式 - 存储器： | 闪存 |
| 存储器类型： | FLASH |
| 存储容量： | 8M（1M x 8） |
| 速度： | 104MHz |
| 接口： | SPI 串行 |
| 电源电压： | 2.7 V ~ 3.6 V |
| 工作温度： | -40°C ~ 85°C |
| 封装/外壳： | 8-SOIC（0.154"，3.90mm 宽） |
| 供应商设备封装： | 8-SOIC |
| 包装： | 管件 |
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W25Q80BV
Table of Contents
1.
2.
3.
GENERAL DESCRIPTION ............................................................................................................... 5
FEATURES ....................................................................................................................................... 5
PACKAGE TYPES AND PIN CONFIGURATIONS .......................................................................... 6
3.1
3.2
3.3
3.4
3.5
3.6
3.7
3.8
3.9
3.10
Pin Configuration SOIC 150 / 208-mil .................................................................................. 6
Pad Configuration WSON 6x5-mm / USON 2x3-mm ........................................................... 6
Pin Configuration PDIP 300-mil............................................................................................ 7
Pin Description SOIC, WSON, USON & PDIP 300-mil ........................................................ 7
pin descriptions..................................................................................................................... 8
Chip Select (/CS) .................................................................................................................. 8
Serial Data Input, Output and IOs (DI, DO and IO0, IO1, IO2, IO3) .................................... 8
Write Protect (/WP)............................................................................................................... 8
HOLD (/HOLD) ..................................................................................................................... 8
Serial Clock (CLK) ................................................................................................................ 8
4.
5.
BLOCK DIAGRAM ............................................................................................................................ 9
FUNCTIONAL DESCRIPTION ....................................................................................................... 10
5.1
SPI OPERATIONS ............................................................................................................. 10
5.1.1
5.1.2
5.1.3
5.1.4
Standard SPI Instructions ..................................................................................................... 10
Dual SPI Instructions ............................................................................................................ 10
Quad SPI Instructions .......................................................................................................... 10
Hold Function ....................................................................................................................... 10
5.2
WRITE PROTECTION ....................................................................................................... 11
5.2.1
Write Protect Features ......................................................................................................... 11
6.
CONTROL AND STATUS REGISTERS ........................................................................................ 12
6.1
STATUS REGISTER .......................................................................................................... 12
6.1.1
6.1.2
6.1.3
6.1.4
6.1.5
6.1.6
6.1.7
6.1.8
6.1.9
6.1.10
6.1.11
6.1.12
BUSY ................................................................................................................................... 12
Write Enable Latch (WEL) .................................................................................................... 12
Block Protect Bits (BP2, BP1, BP0) ...................................................................................... 12
Top/Bottom Block Protect (TB) ............................................................................................. 12
Sector/Block Protect (SEC) .................................................................................................. 12
Complement Protect (CMP) ................................................................................................. 13
Status Register Protect (SRP1, SRP0) ................................................................................ 13
Erase/Program Suspend Status (SUS) ................................................................................ 13
Security Register Lock Bits (LB3, LB2, LB1) ........................................................................ 13
Quad Enable (QE) .............................................................................................................. 14
Status Register Memory Protection (CMP = 0)................................................................... 15
Status Register Memory Protection (CMP = 1)................................................................... 16
6.2
INSTRUCTIONS................................................................................................................. 17
6.2.1
Manufacturer and Device Identification ................................................................................ 17
-2-
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相关代理商/技术参数 |
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|---|---|
| W25Q80BVSNIG TR | 制造商:Winbond Electronics Corp 功能描述: 制造商:Winbond Electronics Corp 功能描述:IC FLASH 8MBIT 104MHZ 8SOIC |
| W25Q80BVSNIP | 制造商:WINBOND 制造商全称:Winbond 功能描述:8M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI |
| W25Q80BVSSAG | 制造商:WINBOND 制造商全称:Winbond 功能描述:8M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI |
| W25Q80BVSSAP | 制造商:WINBOND 制造商全称:Winbond 功能描述:8M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI |
| W25Q80BVSSIG | 功能描述:IC FLASH 8MBIT 8SOIC RoHS:是 类别:集成电路 (IC) >> 存储器 系列:SpiFlash® 标准包装:1 系列:- 格式 - 存储器:闪存 存储器类型:闪存 - NAND 存储容量:4G（256M x 16） 速度:- 接口:并联 电源电压:2.7 V ~ 3.6 V 工作温度:0°C ~ 70°C 封装/外壳:48-TFSOP（0.724"，18.40mm 宽） 供应商设备封装:48-TSOP I 包装:Digi-Reel® 其它名称:557-1461-6 |
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