参数资料
型号: W25X10AVSNIG
厂商: Winbond Electronics
文件页数: 45/45页
文件大小: 0K
描述: IC FLASH 16MBIT 100MHZ 8SOIC
标准包装: 100
系列: SpiFlash®
格式 - 存储器: 闪存
存储器类型: FLASH
存储容量: 1M (128K x 8)
速度: 100MHz
接口: SPI 串行
电源电压: 2.7 V ~ 3.6 V
工作温度: -40°C ~ 85°C
封装/外壳: 8-SOIC(0.154",3.90mm 宽)
供应商设备封装: 8-SOIC
包装: 管件

W25X10A, W25X20A, W25X40A, W25X80A
14. REVISION HISTORY
VERSION
A
B
C
DATE
01/09/08
02/27/08
05/02/08
PAGE
43 & 44
40
DESCRIPTION
New Create
Added note for WSON top side marking
Updated 8-pin PDIP package dimensions
Updated Features section
D
07/23/08
4, 35 & 44
Updated tCLQV
Added G option for PDIP package
E
F
11/25/08
08/07/09
43 & 44
38~44
Updated Ordering Information
Removed G option for PDIP package
Update Package Diagrams
Updated ordering information.
Trademarks
Winbond and SpiFlash are trademarks of Winbond Electronics Corporation.
All other marks are the property of their respective owner.
Important Notice
Winbond products are not designed, intended, authorized or warranted for use as components in
systems or equipment intended for surgical implantation, atomic energy control instruments, airplane
or spaceship instruments, transportation instruments, traffic signal instruments, combustion control
instruments, or for other applications intended to support or sustain life. Further more, Winbond
products are not intended for applications wherein failure of Winbond products could result or lead to
a situation wherein personal injury, death or severe property or environmental damage could occur.
Winbond customers using or selling these products for use in such applications do so at their own risk
and agree to fully indemnify Winbond for any damages resulting from such improper use or sales.
Information in this document is provided solely in connection with Winbond products. Winbond
reserves the right to make changes, corrections, modifications or improvements to this document and
the products and services decribed herein at any time, without notice.
Publication Release Date: August 7, 2009
- 45 -
Revision F
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