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参数资料
| 型号： | W25X20LZPEG |
| 厂商： | WINBOND ELECTRONICS CORP |
| 元件分类： | PROM |
| 英文描述： | 256K X 8 SPI BUS SERIAL EEPROM, PDSO8 |
| 封装： | 6 X 5 MM, GREEN, WSON-8 |
| 文件页数： | 33/46页 |
| 文件大小： | 1226K |
| 代理商： | W25X20LZPEG |
第1页第2页第3页第4页第5页第6页第7页第8页第9页第10页第11页第12页第13页第14页第15页第16页第17页第18页第19页第20页第21页第22页第23页第24页第25页第26页第27页第28页第29页第30页第31页第32页当前第33页第34页第35页第36页第37页第38页第39页第40页第41页第42页第43页第44页第45页第46页
W25X10L, W25X20L, W25X40L, W25X80L
Publication Release Date: February 27, 2008
- 39 -
Revision I
11.2 8-Pin SOIC 208-mil (Package Code SS)
MILLIMETERS
INCHES
SYMBOL
MIN
MAX
MIN
MAX
A
1.75
2.16
0.069
0.085
A1
0.05
0.25
0.002
0.010
A2
1.70
1.91
0.067
0.075
b
0.35
0.48
0.014
0.019
C
0.19
0.25
0.007
0.010
D
5.18
5.38
0.204
0.212
E
7.70
8.10
0.303
0.319
E1
5.18
5.38
0.204
0.212
e
1.27 BSC
0.050 BSC
L
0.50
0.80
0.020
0.031
θ
0o
8o
0o
8o
y
---
0.10
---
0.004
Notes:
1. Controlling dimensions: inches, unless otherwise specified.
2. BSC = Basic lead spacing between centers.
3. Dimensions D and E1 do not include mold flash protrusions and should be measured from the bottom of the package.
4. Formed leads shall be planar with respect to one another within .0004 inches at the seating plane.
相关PDF资料 |
PDF描述 |
|---|---|
| W25X64-VSSI | 64M X 1 FLASH 2.7V PROM, PDSO8 |
| W25Z040AD-3A | 128K X 36 STANDARD SRAM, 3.8 ns, PQFP100 |
| W260A1A004L1 | POWER/SIGNAL RELAY, DPDT, MOMENTARY, 0.038A (COIL), 26.5VDC (COIL), 1007mW (COIL), 2A (CONTACT), 28VDC (CONTACT), SOCKET MOUNT |
| W260A1A004L2 | POWER/SIGNAL RELAY, DPDT, MOMENTARY, 0.038A (COIL), 26.5VDC (COIL), 1007mW (COIL), 2A (CONTACT), 28VDC (CONTACT), SOCKET MOUNT |
| W260A1A004P1 | POWER/SIGNAL RELAY, DPDT, MOMENTARY, 0.038A (COIL), 26.5VDC (COIL), 1007mW (COIL), 2A (CONTACT), 28VDC (CONTACT), SOCKET MOUNT |
相关代理商/技术参数 |
参数描述 |
|---|---|
| W25X20LZPI | 制造商:WINBOND 制造商全称:Winbond 功能描述:1M-BIT, 2M-BIT, 4M-BIT AND 8M-BIT SERIAL FLASH MEMORY WITH 4KB SECTORS AND DUAL OUTPUT SPI |
| W25X20LZPIG | 制造商:WINBOND 制造商全称:Winbond 功能描述:1M-BIT, 2M-BIT, 4M-BIT AND 8M-BIT SERIAL FLASH MEMORY WITH 4KB SECTORS AND DUAL OUTPUT SPI |
| W25X20LZPIZ | 制造商:WINBOND 制造商全称:Winbond 功能描述:1M-BIT, 2M-BIT, 4M-BIT AND 8M-BIT SERIAL FLASH MEMORY WITH 4KB SECTORS AND DUAL OUTPUT SPI |
| W25X20VDAC | 制造商:WINBOND 制造商全称:Winbond 功能描述:1M-BIT, 2M-BIT, 4M-BIT AND 8M-BIT SERIAL FLASH MEMORY WITH 4KB SECTORS AND DUAL OUTPUT SPI |
| W25X20VDACG | 制造商:WINBOND 制造商全称:Winbond 功能描述:1M-BIT, 2M-BIT, 4M-BIT AND 8M-BIT SERIAL FLASH MEMORY WITH 4KB SECTORS AND DUAL OUTPUT SPI |
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