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参数资料
| 型号： | W25X20LZPEG |
| 厂商： | WINBOND ELECTRONICS CORP |
| 元件分类： | PROM |
| 英文描述： | 256K X 8 SPI BUS SERIAL EEPROM, PDSO8 |
| 封装： | 6 X 5 MM, GREEN, WSON-8 |
| 文件页数： | 6/46页 |
| 文件大小： | 1226K |
| 代理商： | W25X20LZPEG |
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W25X10L, W25X20L, W25X40L, W25X80L
Publication Release Date: February 27, 2008
- 14 -
Revision I
9.2 INSTRUCTIONS
The instruction set of the W25X10L/20L/40L/80L consists of fifteen basic instructions that are fully
controlled through the SPI bus (see Instruction Set table). Instructions are initiated with the falling
edge of Chip Select (/CS). The first byte of data clocked into the DIO input provides the instruction
code. Data on the DIO input is sampled on the rising edge of clock with most significant bit (MSB) first.
Instructions vary in length from a single byte to several bytes and may be followed by address bytes,
data bytes, dummy bytes (don’t care), and in some cases, a combination. Instructions are completed
with the rising edge of edge /CS. Clock relative timing diagrams for each instruction are included in
figures 4 through 19. All read instructions can be completed after any clocked bit. However, all
instructions that Write, Program or Erase must complete on a byte boundary (CS driven high after a
full 8-bits have been clocked) otherwise the instruction will be terminated. This feature further protects
the device from inadvertent writes. Additionally, while the memory is being programmed or erased, or
when the Status Register is being written, all instructions except for Read Status Register will be
ignored until the program or erase cycle has completed.
9.2.1
Manufacturer and Device Identification
MANUFACTURER ID
(M7-M0)
Winbond Serial Flash
EFH
Device ID
(ID7-ID0)
(ID15-ID0)
Instruction
ABh, 90h
9Fh
W25X10L
10h
3011h
W25X20L
11h
3012h
W25X40L
12h
3013h
W25X80L
13h
3014h
相关PDF资料 |
PDF描述 |
|---|---|
| W25X64-VSSI | 64M X 1 FLASH 2.7V PROM, PDSO8 |
| W25Z040AD-3A | 128K X 36 STANDARD SRAM, 3.8 ns, PQFP100 |
| W260A1A004L1 | POWER/SIGNAL RELAY, DPDT, MOMENTARY, 0.038A (COIL), 26.5VDC (COIL), 1007mW (COIL), 2A (CONTACT), 28VDC (CONTACT), SOCKET MOUNT |
| W260A1A004L2 | POWER/SIGNAL RELAY, DPDT, MOMENTARY, 0.038A (COIL), 26.5VDC (COIL), 1007mW (COIL), 2A (CONTACT), 28VDC (CONTACT), SOCKET MOUNT |
| W260A1A004P1 | POWER/SIGNAL RELAY, DPDT, MOMENTARY, 0.038A (COIL), 26.5VDC (COIL), 1007mW (COIL), 2A (CONTACT), 28VDC (CONTACT), SOCKET MOUNT |
相关代理商/技术参数 |
参数描述 |
|---|---|
| W25X20LZPI | 制造商:WINBOND 制造商全称:Winbond 功能描述:1M-BIT, 2M-BIT, 4M-BIT AND 8M-BIT SERIAL FLASH MEMORY WITH 4KB SECTORS AND DUAL OUTPUT SPI |
| W25X20LZPIG | 制造商:WINBOND 制造商全称:Winbond 功能描述:1M-BIT, 2M-BIT, 4M-BIT AND 8M-BIT SERIAL FLASH MEMORY WITH 4KB SECTORS AND DUAL OUTPUT SPI |
| W25X20LZPIZ | 制造商:WINBOND 制造商全称:Winbond 功能描述:1M-BIT, 2M-BIT, 4M-BIT AND 8M-BIT SERIAL FLASH MEMORY WITH 4KB SECTORS AND DUAL OUTPUT SPI |
| W25X20VDAC | 制造商:WINBOND 制造商全称:Winbond 功能描述:1M-BIT, 2M-BIT, 4M-BIT AND 8M-BIT SERIAL FLASH MEMORY WITH 4KB SECTORS AND DUAL OUTPUT SPI |
| W25X20VDACG | 制造商:WINBOND 制造商全称:Winbond 功能描述:1M-BIT, 2M-BIT, 4M-BIT AND 8M-BIT SERIAL FLASH MEMORY WITH 4KB SECTORS AND DUAL OUTPUT SPI |
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