参数资料
| 型号： | W25X40CLSSIG |
| 厂商： | Winbond Electronics |
| 文件页数： | 1/2页 |
| 文件大小： | 0K |
| 描述： | IC FLASH SPI 4MBIT 8SOIC |
| 标准包装： | 90 |
| 系列： | SpiFlash® |
| 格式 - 存储器： | 闪存 |
| 存储器类型： | FLASH |
| 存储容量： | 4M (512K x 8) |
| 速度： | 104MHz |
| 接口： | SPI 串行 |
| 电源电压： | 2.3 V ~ 3.6 V |
| 工作温度： | -40°C ~ 85°C |
| 封装/外壳： | * |
| 供应商设备封装： | * |
| 包装： | * |
| 其它名称： | Q7151891 |
Winbond's W25X and W25Q SpiFlash? Multi-I/O Memories feature the popular Serial Peripheral Interface (SPI), densities
from 512K-bit to 256M-bit, small erasable sectors and the industry's highest performance. The W25X family supports
Dual-SPI effectively doubling standard SPI clock rates. The W25Q family is a "superset" of the 25X family with Dual-I/O and
Quad-I/O SPI for even higher performance. Clock rates up to 104MHz achieve an equivalent of 416MHz (50M-Byte/S transfer
rate) when using Quad-SPI. This even surpasses asynchronous Parallel Flash memories while using fewer pins and less
space. Faster transfer rates mean controllers can execute code (XIP) directly from the SPI interface or further improve boot
time when shadowing code to RAM. Some SpiFlash devices offer the new Quad Peripheral Interface (QPI) supporting true
Quad Commands for improved XIP performance and simpler controller circuitry. Additionally, new ultra-small form-factor
packages are ideal for space constrained mobile and handheld applications.
W25X SpiFlash Family
- 512K-bit to 4M-bit
- Serial Peripheral Interface (SPI), Dual Output SPI
- Uniform 4KB, 32KB & 64KB erase
W25Q SpiFlash Family
- 2M-bit to 256M-bit, superset compatible with 25X
- SPI, Dual-SPI, Quad-SPI and QPI (for many devices)
- Uniform 4KB, 32KB & 64KB erase
- Erase and Program Suspend/Resume
- Quad Page Program
- Security: Lock-down, ID#, OTP Registers
- Serial Flash Discoverable Parameters (SFDP)
High Performance
- 104MHz Clock, 416MHz Quad-SPI (50MB/S)
- Fast-boot or execute code (XIP) from SPI
Voltage & Package Options
- 3V (2.7~3.6V), 2.5V (2.3~3.6V) and 1.8V (1.65~1.95V)
- Space saving packages: 8-pin SOIC, WSON, VSOP,
USON, WLBGA (CSP), 16-pin SOIC, 24-ball TFBGA
- Known Good Die (KGD) Wafers
Wide Range of Applications
- PCs, DVD, BluRay, WLAN, DSL/Cable Modem, Printers,
- Hard Drives, Set Top Box, LCD-TV, Mobile Phones,
- Bluetooth, GPS, MP3, Meters, DSP, FPGAs and more
Refer to Winbond Automotive SpiFlash Memory Selection Guide for details of Automotive products.
Winbond also offers the W29GL family of Parallel Flash products from 32Mb through 512Mb densities compatible to industry standard x29GL products.
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相关代理商/技术参数 |
参数描述 |
|---|---|
| W25X40CLUXIG TR | 制造商:Winbond Electronics Corp 功能描述:NOT IN PRICE BOOK CONSULT FACT |
| W25X40CLZPIG | 功能描述:IC FLASH SPI 4MBIT 8WSON RoHS:是 类别:集成电路 (IC) >> 存储器 系列:SpiFlash® 标准包装:2,000 系列:- 格式 - 存储器:RAM 存储器类型:SRAM - 异步 存储容量:256K (32K x 8) 速度:15ns 接口:并联 电源电压:3 V ~ 3.6 V 工作温度:-40°C ~ 85°C 封装/外壳:28-TSSOP（0.465"，11.8mm 宽） 供应商设备封装:28-TSOP 包装:带卷 (TR) 其它名称:71V256SA15PZGI8 |
| W25X40CVSSIG | 功能描述:IC FLASH SPI 4MBIT 8SOIC RoHS:是 类别:集成电路 (IC) >> 存储器 系列:SpiFlash® 标准包装:150 系列:- 格式 - 存储器:EEPROMs - 串行 存储器类型:EEPROM 存储容量:4K (2 x 256 x 8) 速度:400kHz 接口:I²C，2 线串口 电源电压:2.5 V ~ 5.5 V 工作温度:-40°C ~ 85°C 封装/外壳:8-VFDFN 裸露焊盘 供应商设备封装:8-DFN（2x3） 包装:管件 产品目录页面:1445 (CN2011-ZH PDF) |
| W25X40L | 制造商:WINBOND 制造商全称:Winbond 功能描述:1M-BIT, 2M-BIT, 4M-BIT AND 8M-BIT 2.5V SERIAL FLASH MEMORY WITH 4KB SECTORS AND DUAL OUTPUT SPI |
| W25X40LDAC | 制造商:WINBOND 制造商全称:Winbond 功能描述:1M-BIT, 2M-BIT, 4M-BIT AND 8M-BIT SERIAL FLASH MEMORY WITH 4KB SECTORS AND DUAL OUTPUT SPI |
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