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参数资料
| 型号： | W27E01 |
| 英文描述： | FPGA Fusion® Family 250K Gates Commercial 130nm (CMOS) Technology 1.5V 256-Pin FBGA |
| 中文描述： | 存储器 |
| 文件页数： | 13/15页 |
| 文件大小： | 257K |
| 代理商： | W27E01 |
Preliminary W27E01
Publication Release Date: May 30, 2002
- 13 -
Revision A1
18. PACKAGE DIMENSIONS
32-pin P-DIP
Seating Plane
e
A
2
A
a
c
E
Base Plane
1
A
1
e
L
A
S
1
E
D
1
B
B
32
1
16
17
1. Dimensions D Max. & S include mold flash or
2. Dimension E1 does not include interlead flash.
3. Dimensions D & E1 include mold mismatch and
4. Dimension B1 does not include dambar
5. Controlling dimension: Inches.
6. General appearance spec. should be based on
Notes:
1.37
1.22
0.054
0.048
Symbol
Min. Nom. Max.
Max.
Nom.
Min.
Dimension in Inches
Dimension in mm
A
A
A
B
B
1
c
D
E
E
1
e
L
a
A
S
1
2
0.050
1.27
0.210
5.33
0.010
0.150
0.016
0.155
0.018
0.160
0.022
3.81
0.41
0.25
3.94
0.46
4.06
0.56
0.008
0.120
0.670
0.010
0.130
0.014
0.140
0.20
3.05
0.25
3.30
0.36
3.56
0.540
0.555
0.550
13.84
14.10
13.97
17.02
15.24
14.99
15.49
0.600
0.590
0.610
2.29
2.54
2.79
0.090
0.100
0.110
1
e
1.650
1.660
41.91
42.16
0
15
0.085
2.16
0.650
0.630
16.00
16.51
15
0
32-Lead PLCC
L
c
1
b
2
A
H
E
E
e
b
D
H
D
y
A
A
1
Seating Plane
E
G
G
D
1
13
14
20
29
32
4
5
21
30
Notes:
1. Dimensions D & E do not include interlead flash.
2. Dimension b does not include dambar protrusion/intrusion.
3. Controlling dimension: Inches.
4. General appearance spec. should be based on nal
visual inspection sepc.
θ
Symbol
Min. Nom. Max.
Max.
Nom.
Min.
Dimension in Inches
Dimension in mm
A
A
A
b
1
b
c
D
E
e
G
D
G
E
H
E
L
y
1
2
3.56
0.50
H
D
0.020
0.140
2.80
2.67
2.93
0.71
0.66
0.81
0.41
0.46
0.56
0.20
0.25
0.35
13.89
13.97
14.05
11.35
11.43
11.51
1.27
12.45
12.95
13.46
0.530
0.510
0.490
0.050
0.453
0.450
0.447
0.553
0.550
0.547
0.014
0.010
0.008
0.022
0.018
0.016
0.032
0.026
0.028
0.115
0.105
0.110
1.12
1.42
0.044
0.056
0
°
10
°
10
°
0
°
9.91
10.41
10.92
14.86
14.99
15.11
12.32
12.45
12.57
1.91
2.29
0.004
0.095
0.090
0.075
0.495
0.490
0.485
0.595
0.590
0.585
0.430
0.410
0.390
0.10
2.41
θ
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