参数资料
型号: W3E64M72S-333SBM
厂商: MICROSEMI CORP-PMG MICROELECTRONICS
元件分类: DRAM
英文描述: 64M X 72 DDR DRAM, 0.7 ns, PBGA219
封装: 25 X 32 MM, PLASTIC, BGA-219
文件页数: 10/19页
文件大小: 496K
代理商: W3E64M72S-333SBM
W3E64M72S-XSBX
18
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
White Electronic Designs
September 2007
Rev. 3
White Electronic Designs Corp. reserves the right to change products or specications without notice.
ORDERING INFORMATION
WHITE ELECTRONIC DESIGNS CORP.
DDR SDRAM
CONFIGURATION, 64M x 72
2.5V Power Supply
DATA RATE (Mbs)
200 = 200Mbs
250 = 250Mbs
266 = 266Mbs
333 = 333Mbs
PACKAGE:
SB = 219 Plastic Ball Grid Array (PBGA)
DEVICE GRADE:
M = Military
-55°C to +125°C
I = Industrial
-40°C to +85°C
C = Commercial 0°C to +70°C
W 3E 64M 72 S - XXX SB X
相关PDF资料
PDF描述
W3E64M72S-200SBC 64M X 72 DDR DRAM, 0.8 ns, PBGA219
W3E64M72S-333SBC 64M X 72 DDR DRAM, 0.7 ns, PBGA219
W3E64M72S-266SBM 64M X 72 DDR DRAM, 0.75 ns, PBGA219
W3E64M72S-333BC 64M X 72 SYNCHRONOUS DRAM, 0.7 ns, PBGA219
W3E64M72S-250BM 64M X 72 SYNCHRONOUS DRAM, 0.8 ns, PBGA219
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