参数资料
型号: W3H32M72E-667SBC
厂商: WHITE ELECTRONIC DESIGNS CORP
元件分类: DRAM
英文描述: 32M X 72 DDR DRAM, 0.65 ns, PBGA208
封装: 18 X 20 MM, 1 MM PITCH, PLASTIC, BGA-208
文件页数: 21/31页
文件大小: 873K
代理商: W3H32M72E-667SBC
W3H32M72E-XSBX
28
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
White Electronic Designs
July 2009
Rev. 6
White Electronic Designs Corp. reserves the right to change products or specications without notice.
All linear dimensions are millimeters and parenthetically in inches
BOTTOM VIEW
PACKAGE DIMENSION: 208 PLASTIC BALL GRID ARRAY (PBGA)
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
11 10
9
8
7
6
5
4
3
2
1
208 x 0.60 (0.024) NOM
1.0 (0.039)NOM
10.0 (0.394) NOM
18.15 (0.715) MAX
20.15
(0.793)
MAX
18.0
(0.709)
NOM
1.0
(0.039)
NOM
3.20 (0.126) MAX
0.50
(0.020)
NOM
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相关代理商/技术参数
参数描述
W3H32M72E-667SBI 制造商:Microsemi Corporation 功能描述:32M X 72 DDR2, 1.8V, 667MHZ, 208PBGA INDUSTRIAL TEMP. - Bulk
W3H32M72E-667SBM 制造商:PMG/Microsemi 功能描述:
W3H32M72E-ES 制造商:WEDC 制造商全称:White Electronic Designs Corporation 功能描述:32M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package
W3H32M72E-ESC 制造商:WEDC 制造商全称:White Electronic Designs Corporation 功能描述:32M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package
W3H32M72E-ESI 制造商:WEDC 制造商全称:White Electronic Designs Corporation 功能描述:32M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package