| 型号: | W3H64M72E-667ESI |
| 厂商: | MICROSEMI CORP-PMG MICROELECTRONICS |
| 元件分类: | DRAM |
| 英文描述: | 64M X 72 DDR DRAM, PBGA208 |
| 封装: | 17 X 23 MM, 1 MM PITCH, PLASTIC, BGA-208 |
| 文件页数: | 4/30页 |
| 文件大小: | 999K |
| 代理商: | W3H64M72E-667ESI |

相关PDF资料 |
PDF描述 |
|---|---|
| W3H64M72E-667ESM | 64M X 72 DDR DRAM, PBGA208 |
| W3HG32M64EEU665D4MG | 32M X 64 DDR DRAM MODULE, 0.45 ns, ZMA200 |
| W7NCF02GH30CS6FG | 128M X 16 FLASH 3.3V PROM CARD, 150 ns, UUC |
| W7NCF128H20IS9CG | 8M X 16 FLASH 3.3V PROM CARD, 150 ns, UUC |
| WE128K16-150CIA | 128K X 16 EEPROM 5V MODULE, 150 ns, CDMA40 |
相关代理商/技术参数 |
参数描述 |
|---|---|
| W3H64M72E-667ESM | 制造商:WEDC 制造商全称:White Electronic Designs Corporation 功能描述:64M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package |
| W3H64M72E-667SB | 制造商:WEDC 制造商全称:White Electronic Designs Corporation 功能描述:64M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package |
| W3H64M72E-667SBC | 制造商:Microsemi Corporation 功能描述:64M X 72 DDR2, 1.8V, 667MHZ, 208PBGA COMMERICAL TEMP. - Bulk |
| W3H64M72E-667SBI | 制造商:Microsemi Corporation 功能描述:64M X 72 DDR2, 1.8V, 667MHZ, 208PBGA INDUSTRIAL TEMP. - Bulk |
| W3H64M72E-667SBM | 制造商:Microsemi Corporation 功能描述:64M X 72 DDR2, 1.8V, 667MHZ, 208PBGA MIL-TEMP. - Bulk 制造商:Microsemi Corporation 功能描述:SDRAM MEMORY |