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参数资料
| 型号： | W72M64V-120BC |
| 厂商： | WHITE ELECTRONIC DESIGNS CORP |
| 元件分类： | PROM |
| 英文描述： | 2M X 64 FLASH 3.3V PROM MODULE, 120 ns, PBGA159 |
| 封装： | 13 X 22 MM, 1.27 MM PITCH, PLASTIC, BGA-159 |
| 文件页数： | 15/15页 |
| 文件大小： | 160K |
| 代理商： | W72M64V-120BC |
9
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
W72M64V-XBX
FIG 8: CHIP/SECTOR ERASE OPERATION TIMINGS
Notes:
1.
SA = Sector Address (for Sector Erase), VA = Valid Address for reading status data
FIG 7: ACCELERATED PROGRAM TIMING DIAGRAM
VHH
tVHH
VIL or VIH
WP/ACC
VIL or VIH
Addresses
CS
OE
WE
Data
RY/BY
VCC
2AAh
SA
VA
tWC
tAH
tWHWH2
30h
In
Progress
Complete
55h
tBUSY
VA
tAS
tCH
tWP
tCS
tWPH
tDS
tDH
tVCS
tRB
10 for Chip Erase
555h for
chip erase
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相关代理商/技术参数 |
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| W72M64VB-90BI | 制造商:Microsemi Corporation 功能描述:72 X 64 SRAM MODULE, - Bulk |
| W72M64VB-90BM | 制造商:White Electronic Designs 功能描述:Flash Module Parallel 128Mbit 制造商:Microsemi Corporation 功能描述:72 X 64 SRAM MODULE, - Bulk |
| W72M64VK100BC | 制造商:WEDC 制造商全称:White Electronic Designs Corporation 功能描述:2Mx64 3.3V Simultaneous Operation Flash Multi-Chip Package |
| W72M64VK100BI | 制造商:WEDC 制造商全称:White Electronic Designs Corporation 功能描述:2Mx64 3.3V Simultaneous Operation Flash Multi-Chip Package |
| W72M64VK100BM | 制造商:WEDC 制造商全称:White Electronic Designs Corporation 功能描述:2Mx64 3.3V Simultaneous Operation Flash Multi-Chip Package |
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