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参数资料
| 型号： | W72M64V-120BC |
| 厂商： | WHITE ELECTRONIC DESIGNS CORP |
| 元件分类： | PROM |
| 英文描述： | 2M X 64 FLASH 3.3V PROM MODULE, 120 ns, PBGA159 |
| 封装： | 13 X 22 MM, 1.27 MM PITCH, PLASTIC, BGA-159 |
| 文件页数： | 4/15页 |
| 文件大小： | 160K |
| 代理商： | W72M64V-120BC |
12
White Electronic Designs Corporation Phoenix AZ (602) 437-1520
W72M64V-XBX
Parameter
Speed Options
JEDEC
Std
Description
100
120
150
Unit
t AVAV
tWC
Write Cycle Time (1)
Min
90
120
150
ns
t AVWL
tAS
Address Setup Time
Min
0
ns
t ELAX
tAH
Address Hold Time
Min
45
50
ns
tDVEH
tDS
Data Setup Time
Min
45
50
ns
tEHDX
tDH
Data Hold Time
Min
0
ns
tGHEL
Read Recovery Time Before Write (OE High to WE Low)
Min
0
ns
tWLEL
t WS
WE Setup Time
Min
0
ns
tEHWH
tWH
WE Hold Time
Min
0
ns
tELEH
tCP
CS Pulse Width
Min
45
50
ns
tEHEL
t CPH
CS Pulse Width High
Min
30
ns
tWHWH1
Programming Operation
Byte
Typ
9
s
tWHWH1
Accelerated Programming Operation, Word or Byte
Typ
7
s
tWHWH2
Sector Erase Operation
Typ
0.7
sec
OE
CS
RESET
WE
SA, A6,
A1, A0
Data
1 s
VID
VIH
Valid*
Sector/Sector Block Protect or Unprotect
60h
40h
Status
Verify
Sector/Sector Block Protect: 150 s
Sector/Sector Block Unprotect: 15 ms
FIG 13: SECTOR/SECTOR BLOCK PROTECT AND UNPROTECT TIMING DIAGRAM
NOTES:
For sector protect, A6 = 0, A1 = 1, A0 = 0. For sector unprotect, A6 = 1, A1 = 1, A0 = 0.
AC CHARACTERISTICS – ALTERNATE CS CONTROLLED ERASE AND PROGRAM OPERATIONS
NOTE:
1. Not tested.
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相关代理商/技术参数 |
参数描述 |
|---|---|
| W72M64VB-90BI | 制造商:Microsemi Corporation 功能描述:72 X 64 SRAM MODULE, - Bulk |
| W72M64VB-90BM | 制造商:White Electronic Designs 功能描述:Flash Module Parallel 128Mbit 制造商:Microsemi Corporation 功能描述:72 X 64 SRAM MODULE, - Bulk |
| W72M64VK100BC | 制造商:WEDC 制造商全称:White Electronic Designs Corporation 功能描述:2Mx64 3.3V Simultaneous Operation Flash Multi-Chip Package |
| W72M64VK100BI | 制造商:WEDC 制造商全称:White Electronic Designs Corporation 功能描述:2Mx64 3.3V Simultaneous Operation Flash Multi-Chip Package |
| W72M64VK100BM | 制造商:WEDC 制造商全称:White Electronic Designs Corporation 功能描述:2Mx64 3.3V Simultaneous Operation Flash Multi-Chip Package |
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