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参数资料
| 型号： | W72M64VB70BI |
| 厂商： | MICROSEMI CORP-PMG MICROELECTRONICS |
| 元件分类： | 存储器 |
| 英文描述： | SPECIALTY MEMORY CIRCUIT, PBGA159 |
| 封装： | 13 X 22 MM, PLASTIC, BGA-159 |
| 文件页数： | 16/16页 |
| 文件大小： | 668K |
| 代理商： | W72M64VB70BI |
9
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
White Electronic Designs
W72M64VB-XBX
September 2008
Rev. 0
ADVANCED
FIGURE 8: CHIP/SECTOR ERASE OPERATION TIMINGS
tDH
2AAh
SA
VA
tWC
tAH
tWHWH2
30h
In
Progress
Complete
55h
tBUSY
VA
tAS
tCH
tWP
tCS
tWPH
tDS
tVCS
tRB
10 for Chip Erase
555h for
chip erase
Addresses
CS#
OE#
WE#
Data
RY/BY#
VCC
NOTES: 1. SA = Sector Address (for Sector Erase), VA = Valid Address for reading status data
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相关代理商/技术参数 |
参数描述 |
|---|---|
| W72M64VB-90BI | 制造商:Microsemi Corporation 功能描述:72 X 64 SRAM MODULE, - Bulk |
| W72M64VB-90BM | 制造商:White Electronic Designs 功能描述:Flash Module Parallel 128Mbit 制造商:Microsemi Corporation 功能描述:72 X 64 SRAM MODULE, - Bulk |
| W72M64VK100BC | 制造商:WEDC 制造商全称:White Electronic Designs Corporation 功能描述:2Mx64 3.3V Simultaneous Operation Flash Multi-Chip Package |
| W72M64VK100BI | 制造商:WEDC 制造商全称:White Electronic Designs Corporation 功能描述:2Mx64 3.3V Simultaneous Operation Flash Multi-Chip Package |
| W72M64VK100BM | 制造商:WEDC 制造商全称:White Electronic Designs Corporation 功能描述:2Mx64 3.3V Simultaneous Operation Flash Multi-Chip Package |
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