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参数资料
| 型号： | W72M64VB70BI |
| 厂商： | MICROSEMI CORP-PMG MICROELECTRONICS |
| 元件分类： | 存储器 |
| 英文描述： | SPECIALTY MEMORY CIRCUIT, PBGA159 |
| 封装： | 13 X 22 MM, PLASTIC, BGA-159 |
| 文件页数： | 6/16页 |
| 文件大小： | 668K |
| 代理商： | W72M64VB70BI |
14
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
White Electronic Designs
W72M64VB-XBX
September 2008
Rev. 0
ADVANCED
PACKAGE: 159 PBGA
Bottom View
13.1 (0.516) MAX
11.43 (0.450) NOM
1.27 (0.050) NOM
1.27
(0.050)
NOM
19.05
(0.750)
NOM
22.1
(0.870)
MAX
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
10
9
8
7
6
5
4
3
2
1
159 X 0.762 (0.030) NOM
2.03 (0.080) MAX
0.61 (0.024)
NOM
ALL LINEAR DIMENSIONS ARE IN MILLIMETERS AND PARENTHETICALLY IN INCHES.
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PDF描述 |
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| W764M32V120SBM | 64M X 32 FLASH 3V PROM, 120 ns, PBGA107 |
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相关代理商/技术参数 |
参数描述 |
|---|---|
| W72M64VB-90BI | 制造商:Microsemi Corporation 功能描述:72 X 64 SRAM MODULE, - Bulk |
| W72M64VB-90BM | 制造商:White Electronic Designs 功能描述:Flash Module Parallel 128Mbit 制造商:Microsemi Corporation 功能描述:72 X 64 SRAM MODULE, - Bulk |
| W72M64VK100BC | 制造商:WEDC 制造商全称:White Electronic Designs Corporation 功能描述:2Mx64 3.3V Simultaneous Operation Flash Multi-Chip Package |
| W72M64VK100BI | 制造商:WEDC 制造商全称:White Electronic Designs Corporation 功能描述:2Mx64 3.3V Simultaneous Operation Flash Multi-Chip Package |
| W72M64VK100BM | 制造商:WEDC 制造商全称:White Electronic Designs Corporation 功能描述:2Mx64 3.3V Simultaneous Operation Flash Multi-Chip Package |
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