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| 型号： | W9425G6DH-6I |
| 厂商： | WINBOND ELECTRONICS CORP |
| 元件分类： | DRAM |
| 英文描述： | 16M X 16 DDR DRAM, 0.7 ns, PDSO66 |
| 封装： | 0.400 INCH, 0.65 MM PITCH, ROHS COMPLIANT, TSOP2-66 |
| 文件页数： | 49/53页 |
| 文件大小： | 1817K |
| 代理商： | W9425G6DH-6I |
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W9425G6DH
Publication Release Date:Feb. 12, 2008
- 53 -
Revision A8
13. REVISION HISTORY
VERSION
DATE
PAGE
DESCRIPTION
P0
May, 2005
All
Preliminary data sheet
10
Modify self refresh and auto refresh description
A0
Aug., 2006
25, 26
Modify tDQSCK and tDQSS parameters
A1
Feb., 2007
4
Modify -75 , tRC=67.5nS
A2
Mar. 06, 2007
43, 44
Modify CL 3 drawing
A3
May 22, 2007
29, 30, 31,
32, 33
Add System AC Characteristics with slew rate and
Overshoot/Undershoot Specification detail describes
A4
Jun. 21, 2007
3, 4, 22, 24,
25, 26, 51
Add -6I/75I grade for Ta= -40 to 85°C and update
with package dimensions
A5
Aug. 16, 2007
4, 5, 23, 25,
26, 27, 28
Add -4 grade (DDR500) for TA = 0 to 70°C
A6
Sep. 11, 2007
26
Modify -4 grade, tIS/tIH = 0.6 nS, tWTR = 2 tCK
5, 26, 27,
29
Add max. values of tCK in key parameters table,
revise tDAL parameter, tDAL = (tWR/tCK) + (tRP/tCK)
and remove tDSSK parameters in AC Characteristics
21, 50
Revise Precharged/Active Power Down Mode
A7
Nov. 20, 2007
14, 50, 51
Add input clock frequency change during precharge
power down mode/self refresh mode
A8
Feb. 12, 2008
4, 5, 23, 25,
27
Add -6F grade
Important Notice
Winbond products are not designed, intended, authorized or warranted for use as components
in systems or equipment intended for surgical implantation, atomic energy control
instruments, airplane or spaceship instruments, transportation instruments, traffic signal
instruments, combustion control instruments, or for other applications intended to support or
sustain life. Further more, Winbond products are not intended for applications wherein failure
of Winbond products could result or lead to a situation wherein personal injury, death or
severe property or environmental damage could occur.
Winbond customers using or selling these products for use in such applications do so at their
own risk and agree to fully indemnify Winbond for any damages resulting from such improper
use or sales.
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相关代理商/技术参数 |
参数描述 |
|---|---|
| W9425G6EH | 制造商:WINBOND 制造商全称:Winbond 功能描述:4 M 】 4 BANKS 】 16 BITS DDR SDRAM |
| W9425G6EH_0812 | 制造商:WINBOND 制造商全称:Winbond 功能描述:4 M × 4 BANKS × 16 BITS DDR SDRAM |
| W9425G6EH-5 | 功能描述:IC DDR-400 SDRAM 256MB 66TSSOPII RoHS:是 类别:集成电路 (IC) >> 存储器 系列:- 标准包装:1,000 系列:- 格式 - 存储器:EEPROMs - 串行 存储器类型:EEPROM 存储容量:4K (512 x 8) 速度:400kHz 接口:I²C，2 线串口 电源电压:2.7 V ~ 5.5 V 工作温度:-40°C ~ 85°C 封装/外壳:8-SOIC（0.173"，4.40mm 宽） 供应商设备封装:8-MFP 包装:带卷 (TR) |
| W9425G6EH-5I | 制造商:Winbond Electronics Corp 功能描述: |
| W9425G6JB-5 | 制造商:Winbond Electronics Corp 功能描述:DRAM Chip DDR SDRAM 256M-Bit 16Mx16 2.5V 60-Pin TFBGA 制造商:Winbond Electronics 功能描述:IC MEMORY 制造商:Winbond Electronics Corp 功能描述:IC MEMORY 制造商:Winbond 功能描述:16MX16,256Mb DDRI DRAM ,200MHZ, BGA |
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