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参数资料
| 型号： | WED7G320IDE33ADC25 |
| 厂商： | MICROSEMI CORP-PMG MICROELECTRONICS |
| 元件分类： | PROM |
| 英文描述： | 18M X 16 FLASH 3.3V PROM, DMA144 |
| 封装： | SO-DIMM-144 |
| 文件页数： | 7/8页 |
| 文件大小： | 167K |
| 代理商： | WED7G320IDE33ADC25 |
FM
S6400-
1
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Summer
2004 Fairchild Semiconductor Corporation
www.fairchildsemi.com
FMS6400-1 Rev. 1.0.1
7
Physical Dimensions
8°
0°
SEE DETAIL A
NOTES: UNLESS OTHERWISE SPECIFIED
A) THIS PACKAGE CONFORMS TO JEDEC
MS-012, VARIATION AA, ISSUE C,
B) ALL DIMENSIONS ARE IN MILLIMETERS.
C) DIMENSIONS DO NOT INCLUDE MOLD
FLASH OR BURRS.
D) LANDPATTERN STANDARD: SOIC127P600X175-8M.
E) DRAWING FILENAME: M08AREV13
LAND PATTERN RECOMMENDATION
SEATING PLANE
0.10 C
C
GAGE PLANE
x 45°
DETAIL A
SCALE: 2:1
PIN ONE
INDICATOR
4
8
1
C
M
BA
0.25
B
5
A
5.60
0.65
1.75
1.27
6.20
5.80
3.81
4.00
3.80
5.00
4.80
(0.33)
1.27
0.51
0.33
0.25
0.10
1.75 MAX
0.25
0.19
0.36
0.50
0.25
R0.10
0.90
0.406
(1.04)
OPTION A - BEVEL EDGE
OPTION B - NO BEVEL EDGE
Figure 5. 8- Lead Small Outline Integrated Circuit (SOIC) Package
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify
or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically
the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/.
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