型号: | WEDPS512K32-17BI |
厂商: | WHITE ELECTRONIC DESIGNS CORP |
元件分类: | SRAM |
英文描述: | 512K X 32 MULTI DEVICE SRAM MODULE, 17 ns, PBGA143 |
封装: | 16 X 18 MM, PLASTIC, BGA-143 |
文件页数: | 1/7页 |
文件大小: | 235K |
代理商: | WEDPS512K32-17BI |
相关PDF资料 |
PDF描述 |
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WF128K32A-200HSI | 512K X 8 FLASH 12V PROM MODULE, 200 ns, CPGA66 |
WED2ZLRSP01S38BI | 512K X 32 MULTI DEVICE SRAM MODULE, 3.8 ns, PBGA209 |
WF512K32N-90H1Q5A | 512K X 32 FLASH 5V PROM MODULE, 90 ns, CPGA66 |
WF512K32-120G1TQ5 | 512K X 32 FLASH 5V PROM MODULE, 120 ns, CQFP68 |
WF512K32-150G1TC5A | 512K X 32 FLASH 5V PROM MODULE, 150 ns, CQFP68 |
相关代理商/技术参数 |
参数描述 |
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WEDPS512K32-17BM | 制造商:WEDC 制造商全称:White Electronic Designs Corporation 功能描述:512Kx32 SRAM MULTI-CHIP PACKAGE |
WEDPS512K32-20BC | 制造商:WEDC 制造商全称:White Electronic Designs Corporation 功能描述:512Kx32 SRAM MULTI-CHIP PACKAGE |
WEDPS512K32-20BI | 制造商:WEDC 制造商全称:White Electronic Designs Corporation 功能描述:512Kx32 SRAM MULTI-CHIP PACKAGE |
WEDPS512K32-20BM | 制造商:WEDC 制造商全称:White Electronic Designs Corporation 功能描述:512Kx32 SRAM MULTI-CHIP PACKAGE |
WEDPS512K32LV-12BC | 制造商:WEDC 制造商全称:White Electronic Designs Corporation 功能描述:512Kx32 SRAM 3.3V MULTI-CHIP PACKAGE |