参数资料
型号: WF1M32B-120G2TI3
元件分类: PROM
英文描述: 1M X 32 FLASH 3.3V PROM MODULE, 120 ns, CQFP68
封装: CERAMIC, QFP-68
文件页数: 3/13页
文件大小: 159K
代理商: WF1M32B-120G2TI3
11
White Electronic Designs Corporation Phoenix, AZ (602) 437-1520
WF1M32B-XXX3
PACKAGE 509: 68 LEAD, LOW PROFILE CERAMIC QUAD FLAT PACK, CQFP (G2T)
0.38 (0.015)
± 0.05 (0.002)
0.27 (0.011)
± 0.04 (0.002)
25.15 (0.990)
± 0.26 (0.010) SQ
1.27 (0.050) TYP
24.03 (0.946)
± 0.26 (0.010)
22.36 (0.880)
± 0.26 (0.010) SQ
20.3 (0.800) REF
4.57 (0.180) MAX
0.19 (0.007)
± 0.06 (0.002)
23.87
(0.940) REF
1.0 (0.040)
± 0.127 (0.005)
0.25 (0.010) REF
1
° / 7°
R 0.25
(0.010)
DETAIL A
SEE DETAIL "A"
Pin 1
ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES
0.940"
TYP
The White 68 lead G2T CQFP
fills the same fit and function as
the JEDEC 68 lead CQFJ or 68
PLCC. But the G2T has the TCE
and lead inspection advantage
of the CQFP form.
相关PDF资料
PDF描述
WS512K32N-15H1IA 512K X 32 MULTI DEVICE SRAM MODULE, 15 ns, CHIP66
WS512K32N-20H1QA 512K X 32 MULTI DEVICE SRAM MODULE, 20 ns, CHIP66
WS512K32N-55H1M 512K X 32 MULTI DEVICE SRAM MODULE, 55 ns, CHIP66
WS512K32-55G2TMA 512K X 32 MULTI DEVICE SRAM MODULE, 55 ns, CQFP68
WS512K32L-15G1UC 512K X 32 MULTI DEVICE SRAM MODULE, 15 ns, CQFP68
相关代理商/技术参数
参数描述
WF1M32B-120G2TI3A 制造商:WEDC 制造商全称:White Electronic Designs Corporation 功能描述:1Mx32 3.3V Flash Module
WF1M32B-120G2TI5 制造商:未知厂家 制造商全称:未知厂家 功能描述:x32 Flash EEPROM Module
WF1M32B-120G2TI5A 制造商:未知厂家 制造商全称:未知厂家 功能描述:x32 Flash EEPROM Module
WF1M32B-120G2TM3 制造商:Microsemi Corporation 功能描述:1M X 32 FLASH MODULE, 3.3V, 120NS, BOOT BLOCK, 68 CQFP 0.88" - Bulk
WF1M32B-120G2TM3A 制造商:WEDC 制造商全称:White Electronic Designs Corporation 功能描述:1Mx32 3.3V Flash Module