参数资料
型号: WF1M32B-120H1M3
厂商: MICROSEMI CORP-PMG MICROELECTRONICS
元件分类: PROM
英文描述: 1M X 32 FLASH 3.3V PROM MODULE, 120 ns, CPGA66
封装: 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66
文件页数: 11/13页
文件大小: 600K
代理商: WF1M32B-120H1M3
7
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
White Electronic Designs
WF1M32B-XXX3
March 2007
Rev. 6
White Electronic Designs Corp. reserves the right to change products or specications without notice.
NOTES:
1. PA is the address of the memory location to be programmed.
2. PD is the data to be programmed at byte address.
3. D7# is the output of the complement of the data written to each chip.
4. DOUT is the output of the data written to the device.
5. Figure indicates last two bus cycles of four bus cycle sequence.
WRITE/ERASE/PROGRAM OPERATION, WE# CONTROLLED
s
e
s
er
d
A
CS#
E#
O
E#
W
at
a
D
V
0.
5
A
P
A
P
H
5
t
C
W
t
S
C
D
P
D#
7
D
T
U
O
t
H
A
t
H
P
W
t
H
D
t
S
D
Data#
Polling
t
S
A
t
C
R
t
P
W
H
0
A
0
A
t
E
O
t
F
D
t
H
O
t
E
C
t
L
W
H
G
t
1
H
W
H
W
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