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参数资料
| 型号： | WF1M32B-120H1M3 |
| 厂商： | MICROSEMI CORP-PMG MICROELECTRONICS |
| 元件分类： | PROM |
| 英文描述： | 1M X 32 FLASH 3.3V PROM MODULE, 120 ns, CPGA66 |
| 封装： | 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66 |
| 文件页数： | 5/13页 |
| 文件大小： | 600K |
| 代理商： | WF1M32B-120H1M3 |
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White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
White Electronic Designs
WF1M32B-XXX3
March 2007
Rev. 6
White Electronic Designs Corp. reserves the right to change products or specications without notice.
ORDERING INFORMATION
LEAD FINISH:
Blank = Gold plated leads
A = Solder dip leads
PROGRAMMING VOLTAGE
3 = 3.3V
DEVICE GRADE:
M = Military Screened
-55°C to +125°C
I = Industrial
-40°C to +85°C
C = Commercial
0°C to +70°C
PACKAGE TYPE:
H1 = Ceramic Hex In line Package, HIP (Package 401)
G2U = Ceramic Quad Flat Pack, Low Prole CQFP (Package 510)
ACCESS TIME (ns)
IMPROVEMENT MARK
B = Boot Block (Bottom Sector)
ORGANIZATION, 1M x 32
User congurable as 2M x 16 or 4M x 8
Flash
WHITE ELECTRONIC DESIGNS CORP.
W F 1M32 B - XXX X X 3 X
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相关代理商/技术参数 |
参数描述 |
|---|---|
| WF1M32B-120HC3 | 制造商:Microsemi Corporation 功能描述:1M X 32 FLASH MODULE, 3.3V, 120NS, BOOT BLOCK, 66 PGA 1.185" - Bulk 制造商:White Electronic Designs 功能描述:1M X 32 FLASH MODULE, 3.3V, 120NS, BOOT BLOCK, 66 PGA 1.185" - Bulk |
| WF1M32B-120HC3A | 制造商:WEDC 制造商全称:White Electronic Designs Corporation 功能描述:1Mx32 3.3V Flash Module |
| WF1M32B-120HC5 | 制造商:未知厂家 制造商全称:未知厂家 功能描述:x32 Flash EEPROM Module |
| WF1M32B-120HC5A | 制造商:未知厂家 制造商全称:未知厂家 功能描述:x32 Flash EEPROM Module |
| WF1M32B-120HI3 | 制造商:Microsemi Corporation 功能描述:1M X 32 FLASH MODULE, 3.3V, 120NS, BOOT BLOCK, 66 PGA 1.185" - Bulk 制造商:White Electronic Designs 功能描述:1M X 32 FLASH MODULE, 3.3V, 120NS, BOOT BLOCK, 66 PGA 1.185" - Bulk |
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