参数资料
型号: WF1M32B-150H1C3
厂商: MICROSEMI CORP-PMG MICROELECTRONICS
元件分类: PROM
英文描述: 1M X 32 FLASH 3.3V PROM MODULE, 150 ns, CPGA66
封装: 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66
文件页数: 12/13页
文件大小: 600K
代理商: WF1M32B-150H1C3
8
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
White Electronic Designs
WF1M32B-XXX3
March 2007
Rev. 6
White Electronic Designs Corp. reserves the right to change products or specications without notice.
AC WAVEFORMS CHIP/SECTOR ERASE OPERATIONS
NOTE:
1. SA is the sector address for Sector Erase.
Addresses
CS#
OE#
WE#
Data
V
CC
5555H
2AAAH
SA
5555H
tWP
tCS
tVCS
1010H/3030H
5555H
8080H
5555H
AAAAH
tAH
tAS
tGHWL
tWPH
tDH
tDS
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相关代理商/技术参数
参数描述
WF1M32B-150HC3 制造商:Microsemi Corporation 功能描述:1M X 32 FLASH MODULE, 3.3V, 150NS, BOOT BLOCK, 66 PGA 1.185" - Bulk
WF1M32B-150HC3A 制造商:WEDC 制造商全称:White Electronic Designs Corporation 功能描述:1Mx32 3.3V Flash Module
WF1M32B-150HI3 制造商:Microsemi Corporation 功能描述:1M X 32 FLASH MODULE, 3.3V, 150NS, BOOT BLOCK, 66 PGA 1.185" - Bulk
WF1M32B-150HI3A 制造商:WEDC 制造商全称:White Electronic Designs Corporation 功能描述:1Mx32 3.3V Flash Module
WF1M32B-150HM3 制造商:Microsemi Corporation 功能描述:1M X 32 FLASH MODULE, 3.3V, 150NS, BOOT BLOCK, 66 PGA 1.185" - Bulk