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参数资料
| 型号： | WF1M32B-150H1C3 |
| 厂商： | MICROSEMI CORP-PMG MICROELECTRONICS |
| 元件分类： | PROM |
| 英文描述： | 1M X 32 FLASH 3.3V PROM MODULE, 150 ns, CPGA66 |
| 封装： | 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66 |
| 文件页数： | 3/13页 |
| 文件大小： | 600K |
| 代理商： | WF1M32B-150H1C3 |
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White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
White Electronic Designs
WF1M32B-XXX3
March 2007
Rev. 6
White Electronic Designs Corp. reserves the right to change products or specications without notice.
PACKAGE 510: 68 LEAD, CERAMIC QUAD FLAT PACK, CQFP (G2U)
ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES
oo
0.940" TYP
The White 68 lead G2U CQFP lls the same t
and function as the JEDEC 68 lead CQFJ or
68 PLCC. But the G2U has the TCE and lead
inspection advantage of the CQFP form.
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相关代理商/技术参数 |
参数描述 |
|---|---|
| WF1M32B-150HC3 | 制造商:Microsemi Corporation 功能描述:1M X 32 FLASH MODULE, 3.3V, 150NS, BOOT BLOCK, 66 PGA 1.185" - Bulk |
| WF1M32B-150HC3A | 制造商:WEDC 制造商全称:White Electronic Designs Corporation 功能描述:1Mx32 3.3V Flash Module |
| WF1M32B-150HI3 | 制造商:Microsemi Corporation 功能描述:1M X 32 FLASH MODULE, 3.3V, 150NS, BOOT BLOCK, 66 PGA 1.185" - Bulk |
| WF1M32B-150HI3A | 制造商:WEDC 制造商全称:White Electronic Designs Corporation 功能描述:1Mx32 3.3V Flash Module |
| WF1M32B-150HM3 | 制造商:Microsemi Corporation 功能描述:1M X 32 FLASH MODULE, 3.3V, 150NS, BOOT BLOCK, 66 PGA 1.185" - Bulk |
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