参数资料
型号: WF1M32B-150H1C3A
厂商: MICROSEMI CORP-PMG MICROELECTRONICS
元件分类: PROM
英文描述: 1M X 32 FLASH 3.3V PROM MODULE, 150 ns, CPGA66
封装: 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66
文件页数: 10/13页
文件大小: 600K
代理商: WF1M32B-150H1C3A
6
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
White Electronic Designs
WF1M32B-XXX3
March 2007
Rev. 6
White Electronic Designs Corp. reserves the right to change products or specications without notice.
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相关PDF资料
PDF描述
WF1M32B-120G2UI3 1M X 32 FLASH 3.3V PROM MODULE, 120 ns, CQFP68
WF1M32B-150G2UC3A 1M X 32 FLASH 3.3V PROM MODULE, 150 ns, CQFP68
WF1M32B-100G2UC3A 1M X 32 FLASH 3.3V PROM MODULE, 100 ns, CQFP68
WF1M32B-120H1C3 1M X 32 FLASH 3.3V PROM MODULE, 120 ns, CPGA66
WF1M32B-100G2UI3 1M X 32 FLASH 3.3V PROM MODULE, 100 ns, CQFP68
相关代理商/技术参数
参数描述
WF1M32B-150HC3 制造商:Microsemi Corporation 功能描述:1M X 32 FLASH MODULE, 3.3V, 150NS, BOOT BLOCK, 66 PGA 1.185" - Bulk
WF1M32B-150HC3A 制造商:WEDC 制造商全称:White Electronic Designs Corporation 功能描述:1Mx32 3.3V Flash Module
WF1M32B-150HI3 制造商:Microsemi Corporation 功能描述:1M X 32 FLASH MODULE, 3.3V, 150NS, BOOT BLOCK, 66 PGA 1.185" - Bulk
WF1M32B-150HI3A 制造商:WEDC 制造商全称:White Electronic Designs Corporation 功能描述:1Mx32 3.3V Flash Module
WF1M32B-150HM3 制造商:Microsemi Corporation 功能描述:1M X 32 FLASH MODULE, 3.3V, 150NS, BOOT BLOCK, 66 PGA 1.185" - Bulk