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参数资料
| 型号： | WF1M32B-150H1C3A |
| 厂商： | MICROSEMI CORP-PMG MICROELECTRONICS |
| 元件分类： | PROM |
| 英文描述： | 1M X 32 FLASH 3.3V PROM MODULE, 150 ns, CPGA66 |
| 封装： | 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66 |
| 文件页数： | 4/13页 |
| 文件大小： | 600K |
| 代理商： | WF1M32B-150H1C3A |
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White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
White Electronic Designs
WF1M32B-XXX3
March 2007
Rev. 6
White Electronic Designs Corp. reserves the right to change products or specications without notice.
PACKAGE 400: 66 PIN, PGA TYPE, CERAMIC HEX-IN-LINE PACKAGE, HIP (H1)
4.60 (0.181)
ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES
相关PDF资料 |
PDF描述 |
|---|---|
| WF1M32B-120G2UI3 | 1M X 32 FLASH 3.3V PROM MODULE, 120 ns, CQFP68 |
| WF1M32B-150G2UC3A | 1M X 32 FLASH 3.3V PROM MODULE, 150 ns, CQFP68 |
| WF1M32B-100G2UC3A | 1M X 32 FLASH 3.3V PROM MODULE, 100 ns, CQFP68 |
| WF1M32B-120H1C3 | 1M X 32 FLASH 3.3V PROM MODULE, 120 ns, CPGA66 |
| WF1M32B-100G2UI3 | 1M X 32 FLASH 3.3V PROM MODULE, 100 ns, CQFP68 |
相关代理商/技术参数 |
参数描述 |
|---|---|
| WF1M32B-150HC3 | 制造商:Microsemi Corporation 功能描述:1M X 32 FLASH MODULE, 3.3V, 150NS, BOOT BLOCK, 66 PGA 1.185" - Bulk |
| WF1M32B-150HC3A | 制造商:WEDC 制造商全称:White Electronic Designs Corporation 功能描述:1Mx32 3.3V Flash Module |
| WF1M32B-150HI3 | 制造商:Microsemi Corporation 功能描述:1M X 32 FLASH MODULE, 3.3V, 150NS, BOOT BLOCK, 66 PGA 1.185" - Bulk |
| WF1M32B-150HI3A | 制造商:WEDC 制造商全称:White Electronic Designs Corporation 功能描述:1Mx32 3.3V Flash Module |
| WF1M32B-150HM3 | 制造商:Microsemi Corporation 功能描述:1M X 32 FLASH MODULE, 3.3V, 150NS, BOOT BLOCK, 66 PGA 1.185" - Bulk |
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