参数资料
型号: WS128K32-25G4TQA
厂商: MICROSEMI CORP-PMG MICROELECTRONICS
元件分类: SRAM
英文描述: 128K X 32 MULTI DEVICE SRAM MODULE, 25 ns, CQFP68
封装: 40 MM, 3.56 MM HEIGHT, CERAMIC, QFP-68
文件页数: 10/11页
文件大小: 375K
代理商: WS128K32-25G4TQA
8
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
White Electronic Designs
WS128K32-XXX
PACKAGE 524: 68 LEAD, CERAMIC QUAD FLAT PACK, LOW PROFILE CQFP (G1T)
ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES
25.27 (0.995)
± 0.13 (0.005) SQ
23.88 (0.940)
± 0.25 (0.010) SQ
0.38 (0.015)
± 0.05 (0.002)
20.3 (0.800) REF
1.27 (0.050)
4.06 (0.160) MAX
0.25 (0.010) MAX
SEE DETAIL "A"
0.84 (0.033) REF
DETAIL A
0.83 (0.033)
± 0.32 (0.013)
0
0/80
PACKAGE 528: 68 LEAD, CERAMIC QUAD FLAT PACK, CQFP (G2L)
ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES
25.15 (0.990) – 0.25 (0.010) MAX
22.36 (0.880) – 0.25 (0.010) MAX
20.31 (0.800) REF
0.38 (0.015) – 0.05 (0.002)
1.27 (0.050) TYP
5.10 (0.200) MAX
0.25 (0.010) – 0.10 (0.002)
24.0 (0.946)
– 0.25 (0.010)
0.23 (0.009) REF
R 0.127
(0.005)
2
O / 9O
0.89 (0.035)
– 1.14 (0.045)
1.37 (0.054) MIN
0.004
0.940" TYP
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