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参数资料
| 型号： | WS128K32-25G4TQA |
| 厂商： | MICROSEMI CORP-PMG MICROELECTRONICS |
| 元件分类： | SRAM |
| 英文描述： | 128K X 32 MULTI DEVICE SRAM MODULE, 25 ns, CQFP68 |
| 封装： | 40 MM, 3.56 MM HEIGHT, CERAMIC, QFP-68 |
| 文件页数： | 11/11页 |
| 文件大小： | 375K |
| 代理商： | WS128K32-25G4TQA |
9
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
White Electronic Designs
WS128K32-XXX
LEAD FINISH:
Blank = Gold plated leads
A = Solder dip leads
DEVICE GRADE:
Q = MIL-STD-883 Compliant
M = Military Screened
-55°C to +125°C
I = Industrial
-40°C to +85°C
C = Commercial
0°C to +70°C
PACKAGE TYPE:
H1= 1.075" sq. Ceramic Hex-In-line Package, HIP (Package 400)
G2U = 22.4mm Ceramic Quad Flat Pack, CQFP (Package 510)
G2L = 22.4mm Ceramic Quad Flat Pack, CQFP (Package 528)
G1U1 = 23.9mm Ceramic Quad Flat Pack, Low Profile CQFP (Package 519)
G1T = 23.9mm Ceramic Quad Flat Pack, Low Profile CQFP (Package 524)
G4T1 = 40 mm Low Profile CQFP (Package 502)
ACCESS TIME (ns)
IMPROVEMENT MARK:
N = No Connect at pin 8, 21, 28 and 39 in HIP for Upgrades
L = Low Power*
ORGANIZATION, 128Kx32
User configurable as 256Kx16 or 512Kx8
SRAM
WHITE ELECTRONIC DESIGNS CORPORATION
ORDERING INFORMATION
W S
128K 32 X - XXX X X X
* Low Power Data Retention only available in G2U, G2L, G1U, G1T PackageTypes
Note 1: Package Not Recommended For New Designs
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相关代理商/技术参数 |
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| WS128K32-35G2I | 制造商:未知厂家 制造商全称:未知厂家 功能描述:x32 SRAM Module |
| WS128K32-35G2LIA | 制造商:White Electronic Designs 功能描述:Res Thin Film 2010 374K Ohm 0.1% 1/4W ±10ppm/°C Molded SMD Plastic T/R 制造商:Microsemi Corporation 功能描述:MICROCIRCUIT, SRAM, 128K X 32 - Bulk |
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| WS128K32-35G2Q | 制造商:未知厂家 制造商全称:未知厂家 功能描述:x32 SRAM Module |
| WS128K32-35G2TC | 制造商:未知厂家 制造商全称:未知厂家 功能描述:x32 SRAM Module |
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