参数资料
型号: WS128K32V-35G1TI
厂商: WHITE ELECTRONIC DESIGNS CORP
元件分类: SRAM
英文描述: 128K X 32 MULTI DEVICE SRAM MODULE, 35 ns, CQFP68
封装: 23.90 MM, CERAMIC, QFP-68
文件页数: 7/9页
文件大小: 330K
代理商: WS128K32V-35G1TI
7
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
White Electronic Designs
WS128K32V-XXX
PACKAGE 510: 68 LEAD, LOW PROFILE CERAMIC QUAD FLAT PACK, CQFP (G2U)
ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES
PACKAGE 519: 68 LEAD, CERAMIC QUAD FLAT PACK, CQFP (G1U)1
ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES
Note 1: Package Not Recommended For New Design
相关PDF资料
PDF描述
WE128K32N-300HQ 512K X 8 EEPROM 5V MODULE, 300 ns, CHIP66
WMDE4M4V-100F2C 4M X 4 EDO DRAM, 100 ns, CDSO24
WMS128K8L-17FIEA 128K X 8 STANDARD SRAM, 17 ns, CDFP36
WMS128K8L-20FCE 128K X 8 STANDARD SRAM, 20 ns, CDFP36
WS128K32N-70H1Q 512K X 8 MULTI DEVICE SRAM MODULE, 70 ns, CHIP66
相关代理商/技术参数
参数描述
WS128K32V-35G1UC 制造商:未知厂家 制造商全称:未知厂家 功能描述:128Kx32 3.3V SRAM MULTICHIP PACKAGE
WS128K32V-35G1UCA 制造商:未知厂家 制造商全称:未知厂家 功能描述:128Kx32 3.3V SRAM MULTICHIP PACKAGE
WS128K32V-35G1UI 制造商:未知厂家 制造商全称:未知厂家 功能描述:128Kx32 3.3V SRAM MULTICHIP PACKAGE
WS128K32V-35G1UIA 制造商:未知厂家 制造商全称:未知厂家 功能描述:128Kx32 3.3V SRAM MULTICHIP PACKAGE
WS128K32V-35G1UM 制造商:未知厂家 制造商全称:未知厂家 功能描述:128Kx32 3.3V SRAM MULTICHIP PACKAGE