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参数资料
| 型号： | WS1M32-20H2IA |
| 厂商： | WHITE ELECTRONIC DESIGNS CORP |
| 元件分类： | SRAM |
| 英文描述： | 1M X 32 MULTI DEVICE SRAM MODULE, 20 ns, CPGA66 |
| 封装： | 1.385 X 1.385 INCH, HERMETIC SEALED, CERAMIC, HIP-66 |
| 文件页数： | 6/7页 |
| 文件大小： | 479K |
| 代理商： | WS1M32-20H2IA |
WS1M32-XH2X
6
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
White Electronic Designs
White Electronic Designs Corp. reserves the right to change products or specications without notice.
March 2009
Rev. 8
ORDERING INFORMATION
LEAD FINISH:
Blank = Gold plated leads
A
=
Solder dip leads
DEVICE GRADE:
M
=
Military Screened
-55°C to +125°C
I
=
Industrial
-40°C to +85°C
C
=
Commercial
0°C to +70°C
PACKAGE TYPE:
H2 = Ceramic Hex-In-line Package, HIP (Package 402)
ACCESS TIME (ns)
ORGANIZATION, two banks of 512Kx32
User congurable as 2Mx16 or 4Mx8
SRAM
WHITE ELECTRONIC DESIGNS CORP.
W S 1M32 - XX H2 X X
相关PDF资料 |
PDF描述 |
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| WS1M32-20H2MA | 1M X 32 MULTI DEVICE SRAM MODULE, 20 ns, CPGA66 |
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相关代理商/技术参数 |
参数描述 |
|---|---|
| WS1M32-20HSC | 制造商:未知厂家 制造商全称:未知厂家 功能描述:1Mx32 SRAM MODULE |
| WS1M32-20HSCA | 制造商:未知厂家 制造商全称:未知厂家 功能描述:1Mx32 SRAM MODULE |
| WS1M32-20HSI | 制造商:未知厂家 制造商全称:未知厂家 功能描述:1Mx32 SRAM MODULE |
| WS1M32-20HSIA | 制造商:未知厂家 制造商全称:未知厂家 功能描述:1Mx32 SRAM MODULE |
| WS1M32-20HSM | 制造商:未知厂家 制造商全称:未知厂家 功能描述:1Mx32 SRAM MODULE |
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