参数资料
型号: WS1M32-20H2MA
厂商: MICROSEMI CORP-PMG MICROELECTRONICS
元件分类: SRAM
英文描述: 1M X 32 MULTI DEVICE SRAM MODULE, 20 ns, CPGA66
封装: 1.385 X 1.385 INCH, HERMETIC SEALED, CERAMIC, HIP-66
文件页数: 5/7页
文件大小: 479K
代理商: WS1M32-20H2MA
WS1M32-XH2X
5
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
White Electronic Designs
White Electronic Designs Corp. reserves the right to change products or specications without notice.
March 2009
Rev. 8
66 PIN, PGA TYPE, CERAMIC HEX-IN-LINE PACKAGE, HIP (H2)
35.2 (1.385) ± 0.38 (0.015) SQ
25.4 (1.0) TYP
15.24 (0.600) TYP
0.76 (0.030) ± 0.1 (0.005)
5.7 (0.223)
MAX
3.81 (0.150)
± 0.1 (0.005)
2.54 (0.100)
TYP
25.4 (1.0) TYP
1.27 (0.050) ± 0.1 (0.005)
1.27 (0.050) TYP DIA
0.46 (0.018) ± 0.05 (0.002) DIA
PIN 1 IDENTIFIER
SQUARE PAD
ON BOTTOM
ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES
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