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参数资料
| 型号： | WS512K32-17G4TQ |
| 厂商： | WHITE ELECTRONIC DESIGNS CORP |
| 元件分类： | SRAM |
| 英文描述： | 512K X 32 MULTI DEVICE SRAM MODULE, 17 ns, CQFP68 |
| 封装： | 40 X 40 MM, 3.50 MM HEIGHT, HERMETIC SEALED, CERAMIC, QFP-68 |
| 文件页数： | 10/11页 |
| 文件大小： | 577K |
| 代理商： | WS512K32-17G4TQ |
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White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
White Electronic Designs
WS512K32-XXX
May 2006
Rev. 17
LEAD FINISH:
Blank = Gold plated leads
A = Solder dip leads
DEVICE GRADE:
Q = MIL-STD-883 Compliant
M = Military Screened -55°C to +125°C
I = Industrial
-40°C to 85°C
C = Commercial
0°C to +70°C
PACKAGE TYPE:
H1 = Ceramic Hex-In-line Package, HIP (Package 400)
G2U = 22.4mm Ceramic Quad Flat Pack, CQFP (Package 510)
G2L = 22.4mm Ceramic Quad Flat Pack, CQFP (Package 528)
G4T1 = 40mm Low Prole CQFP (Package 502)
ACCESS TIME (ns)
IMPROVEMENT MARK:
Blank = Standard Power
N = No Connect at pin 21 and 39 in HIP for Upgrades
L = Low Power Data Retention
ORGANIZATION, 512Kx32
User congurable as 1Mx16 or 2Mx8
SRAM
WHITE ELECTRONIC DESIGNS CORP.
W S 512K 32 X - XXX X X X
Note 1: Package Not Recommended For New Design
ORDERING INFORMATION
相关PDF资料 |
PDF描述 |
|---|---|
| WS512K32N-45H1Q | 512K X 32 MULTI DEVICE SRAM MODULE, 45 ns, CPGA66 |
| WS512K32N-20H1C | 512K X 32 MULTI DEVICE SRAM MODULE, 20 ns, CPGA66 |
| WS512K32N-45G2UI | 512K X 32 MULTI DEVICE SRAM MODULE, 45 ns, CQFP68 |
| WS512K32N-35G2LIA | 512K X 32 MULTI DEVICE SRAM MODULE, 35 ns, CQFP68 |
| WS1M32-20H2IA | 1M X 32 MULTI DEVICE SRAM MODULE, 20 ns, CPGA66 |
相关代理商/技术参数 |
参数描述 |
|---|---|
| WS512K32-17G4TQA | 制造商:未知厂家 制造商全称:未知厂家 功能描述:SRAM|512KX32|CMOS|QFL|68PIN|CERAMIC |
| WS512K32-20G2I | 制造商:未知厂家 制造商全称:未知厂家 功能描述:x32 SRAM Module |
| WS512K32-20G2M | 制造商:未知厂家 制造商全称:未知厂家 功能描述:x32 SRAM Module |
| WS512K32-20G2Q | 制造商:未知厂家 制造商全称:未知厂家 功能描述:x32 SRAM Module |
| WS512K32-20G2TC | 制造商:未知厂家 制造商全称:未知厂家 功能描述:x32 SRAM Module |
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