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参数资料
| 型号： | WS512K32V-20G2TC |
| 厂商： | MICROSEMI CORP-PMG MICROELECTRONICS |
| 元件分类： | SRAM |
| 英文描述： | 512K X 32 MULTI DEVICE SRAM MODULE, 20 ns, CQMA68 |
| 封装： | 22.40 MM, CERAMIC, LQFP-68 |
| 文件页数： | 8/8页 |
| 文件大小： | 245K |
| 代理商： | WS512K32V-20G2TC |
8
White Electronic Designs Corporation Phoenix AZ (602) 437-1520
White Electronic Designs
WS512K32V-XXX
ORDERING INFORMATION
LEAD FINISH:
Blank = Gold plated leads
A = Solderdipleads
DEVICE GRADE:
M = Military
-55°C to +125°C
I = Industrial
-40°C to +85°C
C = Commercial
0°C to +70°C
PACKAGE TYPE:
H1 = 1.075" sq. Ceramic Hex In Line Package, HIP (Package 400)
G2T1 = 22.4mm Ceramic Quad Flat Pack, CQFP (Package 509)
G1U = 23.9mm Ceramic Quad Flat Pack, Low Profile CQFP (Package 519)
ACCESS TIME (ns)
Low Voltage Supply 3.3V ± 10%
IMPROVEMENT MARK:
N = No Connect at pin 21 and 39 in HIP for Upgrades (H1 only)
ORGANIZATION, 512Kx32
User configurable as 1Mx16 or 2Mx8
SRAM
WHITE ELECTRONIC DESIGNS CORP.
W S 512K 32 X V - XXX X X X
Note 1: Package Not Recommended For New Design
相关PDF资料 |
PDF描述 |
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| WS512K32V-20G2TIA | 512K X 32 MULTI DEVICE SRAM MODULE, 20 ns, CQMA68 |
| WS512K32V-15G2TMA | 512K X 32 MULTI DEVICE SRAM MODULE, 15 ns, CQMA68 |
| WS512K32V-20G2TCA | 512K X 32 MULTI DEVICE SRAM MODULE, 20 ns, CQMA68 |
| WS512K32V-17G2TCA | 512K X 32 MULTI DEVICE SRAM MODULE, 17 ns, CQMA68 |
| WS512K48-20G4WM | 512K X 48 MULTI DEVICE SRAM MODULE, 20 ns, CQFP116 |
相关代理商/技术参数 |
参数描述 |
|---|---|
| WS512K32V-20G2TCA | 制造商:未知厂家 制造商全称:未知厂家 功能描述:512Kx32 SRAM 3.3V MODULE |
| WS512K32V-20G2TI | 制造商:未知厂家 制造商全称:未知厂家 功能描述:512Kx32 SRAM 3.3V MODULE |
| WS512K32V-20G2TIA | 制造商:未知厂家 制造商全称:未知厂家 功能描述:512Kx32 SRAM 3.3V MODULE |
| WS512K32V-20G2TM | 制造商:未知厂家 制造商全称:未知厂家 功能描述:512Kx32 SRAM 3.3V MODULE |
| WS512K32V-20G2TMA | 制造商:未知厂家 制造商全称:未知厂家 功能描述:512Kx32 SRAM 3.3V MODULE |
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